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[flemming videbaek <videbaek AT bnl.gov>]

I think it will be most usefull to have the next meeting on Monday 9.30 considering the lullover the Holidays and that we will change to Mondas anyway.

I willsetup the event page and the bluejeans tomorrow.

best F.

Flemming Videbaek

senior scientist

videbaek @ bnl.gov

Brookhaven National Lab

Physics Department

Bldg 510D

Upton, NY 11973

phone: 631-344-4106

cell     :  631-681-1596

On Jan 2, 2020, at 09:00, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:

Dear all,

First of all, I would like to wish you all a very Happy New Year 2020. I hope you all have a very  joyful transition to 2020.

I will be on vacation from tomorrow (1/3) till Friday next week (1/10). Please note that we will need to switch the FST meeting time to Monday 9:30am after next week, because of my teaching constraint for this semester. But for next week, I will leave it to Flemming and Yi to call and chair the meeting, which can be either Monday 9:30am (our new meeting time) or Thursday 9:30am (the old meeting time). If it is Monday, I may be able to call in although I am not completely sure yet.

For the meeting next week, I hope we could hear the status/plan for the following topics:

1. Yi/Han-Sheng: mechanical structure, mounting components onto hybrid, gluing hybrids onto the mechanical structure, storage box, thermal-stress simulation, cooling soft tube test result

2. Mike: status of the v3 T-board and new inner signal cables

3. Zhenyu/Xu: status of the preparation for module assembly at Fermilab
1) module assembly fixtures: UIC machine shop has made all the parts. Fermilab will survey them.
2) module assembly tooling: Fermilab provided the drawings on Dec 16, a couple of days before UIC machine shop closes for holidays. I have requested the machine shop to make them next week.
3) commercial parts needed for assembly fixtures/tooling: Xu has ordered all of them, and received some of them. The rest should arrive by the end of next week.
4) sensors and APV chips: I gave Fermilab 3 inner and 6 outer sensors, and 64 APV chips for prototype module assembly
5) glue and encapsulate: ordered by BNL and received by Fermilab

- in short, I think it should be ready in the week of Jan 20-24

4. Te-Chuan/Flemming: FST Geant model

5. Krishan/Daniel: new tracking code

6. Flemming: feasibility to do the irradiation tests at BNL for the cooling soft tubes and other components.

Best,
Zhenyu
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