Star-fst-l mailing list

["Ye, Zhenyu" <yezhenyu AT uic.edu>]

*** Action items from previous weeks ***
1) Design light-tight box for the DAQ integration test at BNL - Rahul/Xu
-> Xu will send SolidWork drawings to Rahul and Flemming today

2) Discuss how to mount modules onto the half-rings, and half-rings onto 
support structure - Rahul/Yi
-> Discuss after tomorrow’s Forward Meeting. 

3) Document the procedure and requirements of gluing hybrids onto MS for Plan 
A at NTU - Yi
-> 80% done

4) Look into radiation tolerance test of soft cooling tubes at STAR/Taiwan - 
Yi
-> See below

5) BNL send a T-board and cable assembly to NCKU to check if there is any 
conflict with the MS - Mike 
-> Mike will send to Yi tomorrow

6) Looking into alternative clustering algorithm to improve matching 
efficiency - Xu/Zhenyu
-> See below

7) Tune the timing setting for ADC sampling - Xu/Gerard

8) Studying the tracking performance by varying the Z-locations of FST disks, 
and number of r/phi segments - Daniel/Krishan
-> Daniel: Krishan has been working on the remaining r/phi studies for global 
tracks. He has made progress but is also waiting on Daniel. Daniel found some 
places in the code that do not pick up the modified values for r-segment 
length. Daniel working on it and will provide an update to Krishan when 
available.

9) Looking into FST simulation and track reconstruction to compare 300 vs 500 
micron thick sensors - Shenghui
-> See below

0. follow-ups on the action items from last week (see *** below)
1. Integration                                                                
by Rahul Sharma, Felix Archampong
-> Felix made some progresses. Now try to include more features. Will try to 
fix pinning options after discussing with Yi tomorrow. May present progress 
next week

2. Tracking Studies                                                       by 
Daniel Brandenburg, Krishan Gopal

3. Simulation Studies                                                    by 
Shenghui Zhang
-> Little difference found between 300 vs 500 micron thick Silicon sensors 
from simulation, in terms of tracking efficiency, momentum resolution, 
secondary particles and photon conversions. This is expected from the added 
material budget by 200 micron thick Silicon sensor with that of the FST disk, 
and the beam pipe. 
-> It is unclear the definition of primary and secondary particles. Will 
figure out. 
Action item: post code that used to analyze the simulation data and Flemming 
will take a look - Shenghui/Flemming

4. Prototype Module Test                                              by Xu 
Sun
-> Some progresses made. 

5. Mechanical structure                                                 by Yi 
Yang
-> Inner section hybrid for the first prototype module has a maximum 
deviation of 160 microns from flat surface after mounting onto the MS. This 
should be compared to 290 microns of the outer section hybrid. 
-> A small gap (filled with glue?) found at the corner of inner hybrid, which 
is away from the chip areas. The glue pattern seems to be fine. May be due to 
jig and will be adjusted 
-> Electrical tests were successful after inserting and pulling off a female 
connector onto the hybrids
-> Have tried to establish the procedure to align and glue inner and outer 
sections together. Try to understand the measured relative position deviation 
of 290 microns from the drawing, which is larger than expected. 
-> Found bubbles underneath the hybrids after mounting components onto the 
hybrids of the first prototype module. This is believed to be due to the fact 
that the company used 350 degree heat wind to help solder components on top 
of heat sinks. Will hold off on sending the first prototype module to US, but 
instead work on the second prototype module. To overcome the problem, may try 
low temperature solder wire or silver epoxy, and may do it in house. Will try 
to do electrical tests after. If it works, the second prototype module may be 
ready later this week.
-> Added blocks with holes to the inner MS. They were originally added for 
plan B of mounting hybrids onto the MS at AIDC. The holes are now used in the 
assembly to locate the inner section. The blocks do not interfere with the 
assembly jig at Fermilab. 

6. Work for FST at BNL                                                 by 
Flemming 
-> discussed work to be done at BNL in the next two months and the remainder 
of the year

*** Action items ***
1) Design light-tight box for the DAQ integration test at BNL - Rahul/Xu
2) Discuss how to mount modules onto the half-rings, and half-rings onto 
support structure - Rahul/Yi
3) Document the procedure and requirements of gluing hybrids onto MS for Plan 
A at NTU - Yi
4) Look into radiation tolerance test of soft cooling tubes at STAR/Taiwan - 
Yi
5) BNL send a T-board and cable assembly to NCKU to check if there is any 
conflict with the MS - Mike 
6) Looking into alternative clustering algorithm to improve matching 
efficiency - Xu/Zhenyu
7) Tune the timing setting for ADC sampling - Xu/Gerard
8) Studying the tracking performance by varying the Z-locations of FST disks, 
and number of r/phi segments - Daniel/Krishan
9) Looking into FST simulation and track reconstruction to compare 300 vs 500 
micron thick sensors - Shenghui
10) Post code that used to analyze the simulation data and Flemming will take 
a look - Shenghui/Flemming

> On Jun 12, 2020, at 11:49 AM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
> 
> Dear all, 
> 
> We will have the Weekly FST meeting on Monday starting at 9am EST (BNL 
> local time). 
> 
> Bluejeans Meeting URL https://bluejeans.com/101020434
> Meeting ID: 101 020 434
> 
> https://drupal.star.bnl.gov/STAR/event/2020/06/15/star-forward-silicon-tracker-meeting
> 
> Tentative meeting agenda:
> 
> 0. follow-ups on the action items from last week (see *** below)
> 1. Integration                                                              
>         by Rahul Sharma, Felix Archampong
> 2. Tracking Studies                                                       
> by Daniel Brandenburg, Krishan Gopal
> 3. Simulation Studies                                                    by 
> Shenghui Zhang
> 4. Prototype Module Test                                              by Xu 
> Sun
> 5. Mechanical structure                                                 by 
> Yi Yang
> 
> *** Action items from previous weeks ***
> 1) Design light-tight box for the DAQ integration test at BNL - Rahul/Xu
> 2) Discuss how to mount modules onto the half-rings, and half-rings onto 
> support structure - Rahul/Yi
> 3) Document the procedure and requirements of gluing hybrids onto MS for 
> Plan A at NTU - Yi
> 4) Look into radiation tolerance test of soft cooling tubes at STAR/Taiwan 
> - Yi
> 6) UIC send a T-board and cable to NCKU to check if there is any conflict 
> with the MS - Mike 
> 7) Looking into alternative clustering algorithm to improve matching 
> efficiency - Xu/Zhenyu
> 8) Tune the timing setting for ADC sampling - Xu/Gerard
> 9) Studying the tracking performance by varying the Z-locations of FST 
> disks, and number of r/phi segments - Daniel/Krishan
> 10) Looking into FST simulation and track reconstruction to compare 300 vs 
> 500 micron thick sensors - Shenghui
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