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[Yi Yang <yiyang AT ncku.edu.tw>]

Hi Gerard,

It looks good to me and I agree that we should go along this direction.

One thing I would like to get confirmation from you. Do you think I can start to ask the company to solder the rest of connectors on the hybrid (taking out that small metal pieces)? 

I would need to ask them to do it soon, otherwise we will have another delay on the production. 

Cheers,

Yi 

Gerard Visser <gvisser AT indiana.edu>於 2020年11月22日 週日，上午12:10寫道：

hi Yi,
        Attached is a sketch for a "pull tab". I would add Xu in the reply here too
since I know he has some experience in unplugging these things. So I decided to
just reply to the list.
        We can discuss on the meeting monday, but I think we should try out something
along these lines. If successful I think we don't have to worry about connector
to hybrid solder joints or copper on the hybrid breaking due to unplugging the
connectors.
        Sincerely,

                Gerard


On 11/19/2020 9:59 AM, Yi Yang wrote:
> Hi Gerard,
>
> We will have the module assembled using this "new" connector at the end of next
> week.
> Then, I will take some pictures of what you suggested next week.
>
> I am not sure I understand the "pulling tab" idea, could you please tell me
> more about this? Thanks.
>
> Cheers,
> Yi
>
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> Yi Yang, Associate Professor
> Department of Physics
> National Cheng Kung University
> Tainan, 701 Taiwan
> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
> Tel: +886-6-2757575 ext.65237
> Fax: +886-6-2747995
> Group Web: https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!TEY-S_RO7lRl0nkP-NjyqQ3EG8AbXHs2dtUzJk7TxQ33mwFG-nlre7KW5MriKUXteE9pP2M$
> +++++++++++++++++++++++++++++++++++++++++++++++++++
>
>
> On Thu, Nov 19, 2020 at 10:49 PM Gerard Visser <gvisser AT indiana.edu
> <mailto:gvisser AT indiana.edu>> wrote:
>
>     hi Yi,
>              I really don't know what will be best. *Ideally* the connector
>     would have been
>     of a type that had jackscrews built in that detaches the mating connectors as
>     well as secures them when mated. But this is not what we have chosen to do.
>              I have not seen the disassembly procedure. At the setup at UIC, it
>     had to be
>     done rather deeply inside a confined darkbox with rather poor lighting, there
>     was really no oppotunity to see what the process is. For prototyping that's
>     fine, of course.
>              I'd suggest again that someone take decently good and detailed
>     pictures of the
>     mated hybrids/module and T-board (all of the latest revisions of course) and
>     the
>     procedures to mate and especially to unmate them. If we look at this in a
>     meeting someday maybe all will be clear.
>              The forces to unmate the connector should not be applied to the
>     copper of the
>     hybrids, I think that much we all agree on. Directly to the pins of the
>     connector may be fine, or somehow directly to the body of the connector. On the
>     T-board side since the board is rigid and the connector body is fixed to the
>     board, unmating force may be applied to the board I think. In the worst case,
>     the T-board is a replaceable part so no big deal, unlike the hybrid. On the
>     hybrid, epoxy may help the situation if the epoxy is rigid enough and the
>     unmating force is applied to this epoxy (not to the flexible kapton/copper).
>              Sincerely,
>
>                      Gerard
>
>
>     p.s. Possible idea: Since it is decided to modify the connector (remove the
>     fastening screws) perhaps we can epoxy a "pulling tab" on back of the hybrid
>     into the former screw holes of the connector body? That would be an excellent
>     solution, I think. But it will need some experimentation to see if it is really
>     feasible...
>
>
>     On 11/19/2020 9:26 AM, Yi Yang wrote:
>      > Hi Gerard,
>      >
>      > I totally agree with you.
>      > The reason we brought out this “epoxy” idea in our discussion last week
>     is that
>      > we worried about the rigidness between connector and hybrid. Like we
>     mentioned,
>      > it should not be a problem from our assembly procedure and Zhenyu’s
>     experience
>      > on handling the prototype. However, Zhenyu also got a good point that we
>     don’t
>      > know how difficult to handle it when they are put together in the STAR clean
>      > room. If you think it is not a problem, probably we don’t need to go for
>     this
>      > approach.
>      >
>      > Cheers,
>      > Yi
>      >
>      > Gerard Visser <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>
>     <mailto:gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>>於 2020年11月19
>      > 日 週四，下午10:15寫道：
>      >
>      >     hi Yi,
>      >              Ok, I didn't know that. Anyway it is a two part question I
>     guess:
>      >     what is
>      >     needed (in terms of tools) to do a heat cure if that is necessary,
>     and what are
>      >     the compatibility issues with the module i.e. temperature that it can
>     take
>      >     without risk.
>      >              I must say, I am not particularly convinced we benefit from
>     having the
>      >     underfill epoxy. Maybe we do. It all hinges on how the hybrid is to be
>      >     unplugged
>      >     from the T board; when it is just sitting connected there isn't much
>     risk of
>      >     the
>      >     connector breaking off, I think.
>      >              Sincerely,
>      >
>      >                      Gerard
>      >
>      >
>      >     On 11/19/2020 9:06 AM, Yi Yang wrote:
>      >      > Hi Gerard,
>      >      >
>      >      > For the last question, I don't think it will be done at NCKU since we
>      >     will send
>      >      > the modules to UIC before we do it.
>      >      >
>      >      > Cheers,
>      >      > Yi
>      >      >
>      >      >
>      >      > +++++++++++++++++++++++++++++++++++++++++++++++++++
>      >      > Yi Yang, Associate Professor
>      >      > Department of Physics
>      >      > National Cheng Kung University
>      >      > Tainan, 701 Taiwan
>      >      > E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>     <mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>>
>      >     <mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>     <mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>>>
>      >      > Tel: +886-6-2757575 ext.65237
>      >      > Fax: +886-6-2747995
>      >      > Group Web: https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!TEY-S_RO7lRl0nkP-NjyqQ3EG8AbXHs2dtUzJk7TxQ33mwFG-nlre7KW5MriKUXteE9pP2M$
>      >      > +++++++++++++++++++++++++++++++++++++++++++++++++++
>      >      >
>      >      >
>      >      > On Thu, Nov 19, 2020 at 1:17 AM Gerard Visser <gvisser AT indiana.edu
>     <mailto:gvisser AT indiana.edu>
>      >     <mailto:gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>
>      >      > <mailto:gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>
>     <mailto:gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>>> wrote:
>      >      >
>      >      >     hi Mike,
>      >      >              Let me try to answer in below -->
>      >      >              The choice of epoxy or not may also have some interaction
>      >     with any
>      >      >     possible
>      >      >     issues of an unplugging tool which could be needed to unplug the
>      >     hybrid from T
>      >      >     board. I don't know.
>      >      >
>      >      >              Gerard
>      >      >
>      >      >
>      >      >     On 11/18/2020 12:07 PM, Capotosto, Michael wrote:
>      >      >      > Hey everyone,
>      >      >      >
>      >      >      > I just spoke with a rep for Masterbond, left with a few
>     questions I'm
>      >      >     hoping you
>      >      >      > can answer:
>      >      >      >
>      >      >      > 1. Radiation exposure: Do we have any figures on type and rate
>      >     we'll be
>      >      >     exposed to?
>      >      >
>      >      >     I suspect this is not a relevant worry. Of course if we have a
>     spec
>      >     to give
>      >      >     them
>      >      >     it is good to do.
>      >      >
>      >      >      >
>      >      >      > 2. Halogen content,  offgassing: They have low offgassing
>     options
>      >     but no
>      >      >     halogen
>      >      >      > free. Is this an issue for us? Are there any offgassing
>     standards
>      >     we need
>      >      >     to meet?
>      >      >
>      >      >     Likewise, I think we don't care about these things.
>      >      >
>      >      >      >
>      >      >      > 3. Rigidity: I assumed we want something more rigid, let me
>     know
>      >     if we want
>      >      >      > something that cures flexible
>      >      >
>      >      >     Probably, rigid is best as you say.
>      >      >
>      >      >      >
>      >      >      > 4. Application/ Viscosity: I told them we'd likely be hand
>     applying by
>      >      >     syringe,
>      >      >      > and we definitely want electrically nonconductive. I told
>     them thermal
>      >      >      > conductivity isn't a concern. Do we have a preference on
>      >      >     thickness/consistency?
>      >      >      > Some examples they had were toothpaste, honey,  water, etc.
>      >      >
>      >      >     It'll have to wick under the part a bit. "Honey" perhaps?
>      >      >
>      >      >     I'd suggest (if you haven't done already) send them a microscope
>      >     picture of the
>      >      >     connector on hybrid including a side view showing where we
>     would want
>      >     the epoxy
>      >      >     to get it.
>      >      >
>      >      >      >
>      >      >      > I told them we'd probably want something along the lines of
>      >     "toothpaste"
>      >      >     so we
>      >      >      > don't Herve to worry about making a "dam" to hold the epoxy
>     until
>      >     it cures.
>      >      >      >
>      >      >      > 5. Cure method: They asked what kind of temperatures we're
>     able to
>      >     expose
>      >      >     these
>      >      >      > boards to during the curing process - by hot air,  heat lamp,
>      >     etc., or if
>      >      >     this
>      >      >      > is wholly unacceptable.
>      >      >
>      >      >     I don't know. A moderate heat cure is maybe fine but this is
>     for Yi
>      >     to say.
>      >      >
>      >      >      >
>      >      >      > Thanks.
>      >      >      >
>      >      >      > Best,
>      >      >      >
>      >      >      > Michael Capotosto
>      >      >      >
>      >      >      > Get Outlook for Android <https://urldefense.com/v3/__https://aka.ms/ghei36__;!!P4SdNyxKAPE!TEY-S_RO7lRl0nkP-NjyqQ3EG8AbXHs2dtUzJk7TxQ33mwFG-nlre7KW5MriKUXtE-fXbL0$ >
>      >      >
>      >
>      > --
>      > +++++++++++++++++++++++++++++++++++++++++++++++++++
>      > Yi Yang, Associate Professor
>      > Department of Physics
>      > National Cheng Kung University
>      > Tainan, 701 Taiwan
>      > E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>     <mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>>
>      > Tel: +886-6-2757575 ext.65237
>      > Fax: +886-6-2747995
>      > Group Web: https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!TEY-S_RO7lRl0nkP-NjyqQ3EG8AbXHs2dtUzJk7TxQ33mwFG-nlre7KW5MriKUXteE9pP2M$
>      > +++++++++++++++++++++++++++++++++++++++++++++++++++
>
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--

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web: http://phys.ncku.edu.tw/~yiyang
+++++++++++++++++++++++++++++++++++++++++++++++++++