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[董家宁 <jndong AT sdu.edu.cn>]

Dear All,

    The first preliminary version of PCB design for prototype hybrid and T-Board is done. There is a slight modification in hybrid dimension for easy routing. The outer diameter of inner_hybrid is increased by 5 mm, while the outer diameter of outer_hybrid is decreased by 10 mm. The dimension information in detail can be found in the attachment.  

    As for the hybrid layers, we plan to keep the IST design, which means that the connector area is made of 2 layers of 0.5 oz. and 1 layer of 1 oz. copper, while the other areas are made of 2 layers of 0.5 oz. cooper. 

    The project files can be found in the link: https://drupal.star.bnl.gov/STAR/blog/nie/forward-silicon-tracker-hybrid-prototype-1. We'll keep checking and improving. Please let us know if there is something wrong. 

    Thanks!

    Best,

    Jianing

Attachment: hybrid&T-board_update_190131.pdf
Description: Adobe PDF document