Star-fst-l mailing list

[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Minutes

Attendees: Elke, Flemming, Gerard, Hu, Jianing, Krishan, Mike, Prithwish, 
Zhenyu

Mechanical structure - Yi (by email)
(1) We finished modifying the drawings of the mechanical structure (changed 
the locations of the chips and enlarge a bit the heat sinks) today, and I 
just sent it to the company (Easton) for verification. Hope to hear back from 
them tomorrow. 
(2) 8 good cooling tubes which passed the leak test are produced by AIDC and 
we will receive them tomorrow.  
(3) Promised documentation (1st draft) will be released by Monday. All the 
details like test procedures will be included. 


Hybrid/T-board - Jianing/Gerard
Action items:
(1) Jianing will change the temperature sensor address on the outer section 
Hybrid so that it is different than that on the inner section Hybrid 
(2) Gerard and Mike will check the latest hybrid layouts sent by Jianing by 
next Tuesday
(3) Jianing and Gerard will start working on T-board 3.0 layout (only 1 
temperature sensor, 1 reset circuit, etc). The first will be the circuit 
schematics 

T-board/Inner Signal Cable - Mike/Gerard
Decision: we will use the IST-type of cables since alternative options seem 
to be more expensive according to quotes collected by Mike
Action items:
(1) Gerard will check the T-board 2.1 to make sure it can work for prototype 
after some modifications
(2) Gerard will check the latest cable/T-board 2.1 assembly documents sent by 
Mike 

Module Assembly at Fermilab - Zhenyu
Status: discussion with Fermilab designer and UIC machine shop on going. 
Wire-bonding test on whether or not the (0.526,2.6mm) shift is an issue for 
wire-bonding will be done later this week/early next week

Simulation
Status: Te-Chuan is working on detailed modeling of FST sub-structures. 
Krishan is going to discuss with Daniel this weekend about the new tracking 
code

Cooling system - Flemming/Rahul
Gerrit talked to James Kelsey and Jason Bessuille from MIT. They are willing 
to service the IST cooling system to make it work again, but asked us to ship 
the cooling system to MIT. Because this would lead to additional shipping 
costs and make it harder for BNL STSG to take over, it is proposed to request 
the MIT engineers to come to BNL for the service work. Gerrit again expressed 
concerns with using soft tubes in the cooling system with Novec. 
Action item
(1) Elke is going to get into contact with Richard Milner, Redwine
(2) Yi reports the tests he is doing with the compatibility of the soft tubes 
with Novec.  
(3) BNL tests the compatibility of the soft tube with flowing Novec.
(4) Zhenyu will follow up on the grounding of the cooling system if using 
soft (non-conductive) tubes

> On Oct 22, 2019, at 7:56 AM, Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
> 
> Dear all,
> 
> We will have a meeting starting at 9am BNL time this Thursday Oct 24. The 
> meeting agenda and bluejeans info can be found at 
> https://drupal.star.bnl.gov/STAR/blog/yezhenyu/forward-silicon-tracker-weekly-meeting
> 
> 1 Mechanical Structure - Yi Yang, Han-sheng Li
> 2 Hybrid - Jianing Dong
> 3 T-board and Inner Signal Cable - Michael Capotosto
> 4 Module Assembly at Fermilab - Zhenyu Ye
> 5 Simulation - TBD
> 
> Best,
> Zhenyu