Star-fst-l mailing list

["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Minutes

Attendees: Jianing, Krishan, Mike, Te-Chuan, Yi, Yu, Zhenyu

Mechanical structures:
Easton fixed bending issue by adding 3 more injection points. The new parts 
are being shipped to NCKU/AIDC
Per AIDC’s request, Han-Sheng is making minor adjustment to the mechanical 
structure design, making the heat sink taller by the glue height, change the 
pin length between the overlap region in the inner/outer sections. These 
changes won’t affect the module assembly. 
Yi has asked AIDC to design/make the hybrid gluing jig
Han-Sheng examined a piece of soft tube embedded in NOVEC after 1 week, saw 
no visible change under microscope, the mass changed by 0.6%. Another piece 
will be examined for the 2 weeks duration. 
Yi will release his document around this weekend

Hybrid: 
Gerard commented by email on the hybrid layouts (Jianing updated the outer 
hybrid layout on Friday, waiting for confirmation from Gerard.)

T-board and inner signal cable:
Mike is waiting for Gerard’s comments of the proposed changes to T-board v2.1 
for test cable assembly. 

Module Assembly at Fermilab: 
Zhenyu gave the first piece of machined fixture to Fermilab engineers on 
Thursday, who will examine it with CMM. Waiting for their confirmation to 
make the rest at UIC machine shop, or go to alternative machine shop.
Zhenyu met the Fermilab designers to get the status and plan of the remaining 
drawings of the fixtures. They expect to finalize those drawings and pass 
them early next week to Fermilab drafting department to make the production 
drawings. 

Simulation:
No update from Te-Chuan/Krishan

> On Nov 13, 2019, at 2:24 AM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
> 
> Dear all, 
> 
> We will have a weekly FST meeting this Thursday 9am BNL time. The meeting 
> agenda and bluejeans info can be found at 
> https://drupal.star.bnl.gov/STAR/blog/yezhenyu/forward-silicon-tracker-weekly-meeting
> 
> 1. Hybrid, T-board, Inner Signal Cable - Jianing, Gerard, Mike
> 2. Mechanical structure - Yi, Han-Sheng 
> 3. Module Assembly at Fermilab - Zhenyu
> 4. BNL Test stand - Prithwish, Hu
> 5. Simulation - Te-Chuan, Krishan
> 
> Gerard, will you be able to attend the meeting, since we will discuss any 
> remaining issue if any and decide on the v2.2 hybrid production, v2.1 
> T-board modification before test cable assembly?
> 
> We should also hear the latest news on mechanical structure from Yi and 
> Han-Sheng. 
> 
> If there is anything else to report/discuss, please let me know. 
> 
> Best
> Zhenyu
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