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star-fst-l - Re: [Star-fst-l] T-Board V2.1 Mods RE: Re: Weekly FST meeting - 10/24/2019

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  • From: Gerard Visser <gvisser AT indiana.edu>
  • To: Aschenauer Elke-Caroline <elke AT bnl.gov>, Ye Zhenyu <yezhenyu2003 AT gmail.com>
  • Cc: "star-fst-l AT lists.bnl.gov" <star-fst-l AT lists.bnl.gov>
  • Subject: Re: [Star-fst-l] T-Board V2.1 Mods RE: Re: Weekly FST meeting - 10/24/2019
  • Date: Thu, 5 Dec 2019 19:10:21 -0500

Yes, I'll look at that quickly. It seems reasonable to build the v3 T-board, certainly so if we need many for effective testing. The most critical thing as I see it is to prove (with data) the latest hybrid designs and the sensors are ready for production or not. Sorry that I could not make this morning's meeting.

Gerard

On 12/5/2019 6:48 PM, Aschenauer Elke-Caroline wrote:
Dear Zhenyu,

I sent an email already yesterday where I made clear I would go to v3
immediately.
So lets do this. Gerard can you please review the changes if not yet done, so we can proceed.

Cheers elke


On Dec 5, 2019, at 17:16, Zhenyu Ye <yezhenyu2003 AT gmail.com <mailto:yezhenyu2003 AT gmail.com>> wrote:

Hi Elke, Gerard,

At the FST meeting today, we discussed whether or not to make v3 T-boards or stay with v2.1 T-boards with modifications. The former will cost $2093 for 10 boards, with a 10-day delivery time. We also discussed the options for making the cables for prototype module testing, using the old test cables or the new purple cables. The former will cost $1350 (to solder cables onto the T-board), and the latter will cost ~$3700 (to solder cables onto the T-board, and the connectors on the other ends).

(Some cost numbers in the message above may not be very accurate, but should be very close to what Mike said at the meeting).

If the extra cost for BNL is not an issue, using v3 T-board and new purple cables is the preferred option. It should also meet the requirement of getting cables ready by the end of January 2020, if the order of the v3 T-boards goes out this week or beginning of next week. The latter will need Gerard’s review and sign-off of v3 T-board layout sent by Jianing:


On Dec 4, 2019, at 3:52 AM, 董家宁 <jndong AT sdu.edu.cn <mailto:jndong AT sdu.edu.cn>> wrote:

Hi Gerard,
I just finished the layout for v3.0 T-board, please find the gerber files in the attachment or the following link. (https://drupal.star.bnl.gov/STAR/blog/jndong/191204-gerber-files-t-board-v30)
Since the new year is approaching, I think it will take at least 4~5 weeks for production in China after your final approval.

Best,
Jianing

Please let us know if you have any question/comment.

Zhenyu

On Dec 4, 2019, at 10:36 AM, Gerard Visser <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>> wrote:

hi Mike,
I _finally_ -- sorry for huge delays! -- had a careful look at the list of modifications to implement T-board 3.0 functionality on the existing 2.1 boards, for first tests.
You don't have to remove R41 or U9, they can stay. But OK to remove
either/both.
You don't have to remove R15 and R17, they can stay. But OK to remove them. They are in parallel with R37 and R39, and the effective value 5 Ohms is no doubt just as good as 10 Ohms.
Overall, keep in mind the removed items could be from "b" group or from "a" group and whichever may be easier because of placement details is fine. I noticed you elected a mixture (reset and TMP102 from "a", SDA/SCL termination from "b", it's fine).
To MATCH the 3.0 schematic, we ALSO must remove R32, R33, R34, R35 and wire jumpers (small and neat as we can) from net TRGa_P to net TRGb_P, and so on. 4 jumpers.
We must ALSO wire jumpers (not needing to be that small and neat as the TRG & CLK ones!) from net SDAa_in to net SDAb_in and from net SCLKa_in to SCLKb_in.
We must ALSO remove F3 and F4.
And I am presuming here that the power nets GNDa and GNDb are really one net, and VDDa and VDDb, and VSSa and VSSb, and specifically I mean that they are reasonable on the layout (low impedance power connections between all points on these nets). Have you looked into that? If you could please that would be great. I hope it is so.
I attach here my markup of the 2.1 schematic corresponding to my comments above (and your plan below). If the power planes are good for it then doing the marked changes should take care of it, I think. (Please check my work too.)

On the separate matter of whether to just build 3.0 vs. to hack 2.1 to it, let's hear your about your quotes/leadtime options. If we need four units for first tests, and it seems like that will just be a lot easier or if you're unsure about whether these hacks to v2.1 will really work out (in terms of matching 3.0 effectively, or in terms of effort required), it may be better to do that.
I hope we will not have to be making further changes based on fit or performance after the first real prototypes are assembled. That's the motivation to get what we can out of 2.1 (if practical) so that 3.0 can be more definitely the last version. But it may be best to just move on 3.0 and hope for the best, anyway the T-board is a small matter compared to the hybrids. Hopefully we are at the last version on those but the tests will have to prove it.
Sincerely,

Gerard



On 11/14/2019 4:41 PM, Capotosto, Michael wrote:
Gerard,
Have you had a chance yet to review these T-Board V2.1 mods?
--Mike
-----Original Message-----
From: Capotosto, Michael
Sent: Tuesday, November 12, 2019 9:11 AM
To: '董家宁' <jndong AT sdu.edu.cn <mailto:jndong AT sdu.edu.cn>>; 'gerard visser' <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>
Cc: 'zhenyu ye' <yezhenyu2003 AT gmail.com <mailto:yezhenyu2003 AT gmail.com>>
Subject: RE: Re: [Star-fst-l] Weekly FST meeting - 10/24/2019
Hey Gerard,
Just following up regarding these T-Board modifications, we still need to do the mods before we give the t-boards to the vendor, please look this over and let me know.
--Mike
-----Original Message-----
From: Capotosto, Michael
Sent: Wednesday, October 30, 2019 1:02 PM
To: 董家宁 <jndong AT sdu.edu.cn <mailto:jndong AT sdu.edu.cn>>; gerard visser <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>
Cc: zhenyu ye <yezhenyu2003 AT gmail.com <mailto:yezhenyu2003 AT gmail.com>>
Subject: RE: Re: [Star-fst-l] Weekly FST meeting - 10/24/2019
Gerard,
If the new T-Board V3 schematic is all good, I don't think it's necessary to cut any traces to "replicate" the V3 board using the V2.1 board.
**All designators below refer to V2.1 Schematic**
For the double resets: Remove: U9, U10, R41, R42, R45.
For the double temp sensors: Remove U8.
For the bus terminations: Remove R14-17.
Please let us know soon, as we must make these modifications before we hand the boards back over to the vendor, I'd like to leave him enough time to complete this before the December deadline.
Thanks,
Mike
-----Original Message-----
From: 董家宁 <jndong AT sdu.edu.cn <mailto:jndong AT sdu.edu.cn>>
Sent: Tuesday, October 29, 2019 9:49 PM
To: gerard visser <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>
Cc: Capotosto, Michael <capotosto AT bnl.gov <mailto:capotosto AT bnl.gov>>; zhenyu ye <yezhenyu2003 AT gmail.com <mailto:yezhenyu2003 AT gmail.com>>
Subject: Re: Re: [Star-fst-l] Weekly FST meeting - 10/24/2019
Hi Mike and Gerard,
 Thank you very much for pointing out the error.
 The address pin on outer hybrid does need to be connected to the SCK pin (U1->PIN1).
 Please let me know if you find any other mistakes.
 Thanks!
Best,
Jianing
-----原始邮件-----
发件人: "Gerard Visser" <gvisser AT indiana.edu <mailto:gvisser AT indiana.edu>>
发送时间: 2019-10-30 00:38:38 (星期三)
收件人: "Capotosto, Michael" <capotosto AT bnl.gov <mailto:capotosto AT bnl.gov>>, "董家宁"
<jndong AT sdu.edu.cn <mailto:jndong AT sdu.edu.cn>>
抄送: "zhenyu ye" <yezhenyu2003 AT gmail.com <mailto:yezhenyu2003 AT gmail.com>>
主题: Re: [Star-fst-l] Weekly FST meeting - 10/24/2019

hi Mike,
Thanks for the careful looks - I need to look over things still but
will do. It sounds like some issues remain maybe.
The APV chips are on the same I2C bus, that is the main thing. And I
think you're right that the ALERT pin is only used on the T-board,
this implements the overtemperature interlock. But this traces to
historical things of the way it was first implemented (for the FGT)
and I think I have to go read some old emails to remember why we made the choices we did for IST.

Gerard


On 10/29/2019 12:29 PM, Capotosto, Michael wrote:
Jianing,

Thanks for the review.

Jianing and Gerard,

Regarding the hybrids and T-Board, I’ve got a few questions.

1. There are TMP102 temperature sensors on the inner hybrid, outer hybrid,
   T-Board, and Patch Panel Board, all tied to the same I2C line. See attached.
    1. PPB has address tied to SDA
    2. T-Board V3.0 has it tied to VSS
    3. Inner Hybrid tied to V+/VDDa
    4. ***Outer Hybrid tied to Ground*** I believe this is an error…Ground and
       VSS are separated, and only AC coupled on the T-Board. I think you
       intended to tie this pin to VSS – the same as the “GND pin” pin 2 of the
       TMP102 – is this the case? If so, there is still a conflict between the
       T-Board V3.0 address and the outer hybrid address! We should tie this to
       SCL, according to the Datasheet to get our fourth address (0b1001011, 0x4B)
    5. /ALERT Pins

i.These are open drain pins, it appears on the patch panel the pin
was left floating. Are there
advantages/disadvantages/recommendations for floating vs pull up vs pull down?

ii.The T-Board uses the ALERT output to pull the reset down through
a 20k resistor…I just want to confirm, this functionality isn’t used
directly from either hybrid or the PPB, is this correct/intentional?

I’m not sure if you guys have a copy of the PPB schematic I have,
I’m not sure where I even got it from, I’ve attached a copy. Gerard,
do you know if there’s any other addressable devices elsewhere on
this particular I2C bus? Perhaps in the MPOD crate/one of the modules this ties into/etc.?

Other than that…nothing else is jumping out at me.

--Mike
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