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["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Hi Bill, Thanks for the useful info. 

Flemming/Rahul said they found a box made of thick plastics. I am not sure if 
it is the one than that you mentioned below. If yes, that will be a big 
coincidence. Flemming/Rahul, please follow up with Stephen if you would like 
to explore this option.

Zhenyu

> On Aug 17, 2020, at 10:03 AM, Christie, William <christie AT bnl.gov> wrote:
> 
> Hi Zhenyu,
>       I don't know what dimensions you need, nor whether it still exists 
> (I've cc'd Stephen Trentalange) but Stephen constructed a light tight box 
> for testing associated with the FMS. He used it in the Clean room out at 
> STAR. It had light baffled holes for cooling (maybe even integrated fans), 
> ports to get cables in and out, etc. If it is still around it may meet your 
> needs for item 1 under integration.
>       Greetings,
>               Bill
> 
> On 8/17/20, 10:41, "Star-fst-l on behalf of Ye, Zhenyu" 
> <star-fst-l-bounces AT lists.bnl.gov on behalf of yezhenyu AT uic.edu> wrote:
> 
>    Minutes:
> 
>    Integration:
>    1) Design and fabricate light-tight box for the DAQ integration test at 
> BNL - Rahul/Flemming
>    -> Found a dark Box made of thick plastics. Will drill holes for cables 
> and decide how to fix the FST storage box in Nov.
>    2) Design the cooling lines, and cable trays between disks and cooling 
> manifold - Felix/Rahul
>    -> Expect a presentation next week.
>    3) Cooling rack refurbishment and test - Rahul
>    -> Flew NOVEC last Monday, but the system started tripping on Tuesday 
> but no interlock dropped. Will investigate. 
> 
>    Mechanical structure:
>    1) Document the proposed changes to the mechanical structure - Yi
>    -> Will do this week
>    2) Test and examine the new assembly procedure - Yi
>    -> New jigs needed some changes. Done last Friday. May have the results 
> this week
> 
>    Hybrid/T-board/Inner Signal Cable/Patch Panel Board/Back of Crate Board:
>    2) Check how T-board would mount onto MS, and fix cables - 
> Jianing/Maowu/Mike/Gerard 
>    -> Rahul/Felix will give a presentation on cable fixing next week. Will 
> decide whether to keep or remove the four cable-tie holes on the T-board
>    -> Maowu will follow up with Yi to see how to change the holes on the 
> corners of the T-board to slots
> 
>    Production Module assembly:
>    1) Get updated quote from Hamamatsu - Zhenyu
>    -> Done. Hamamatsu final quote and spec for production sensors. 
>    -> Flemming: request has been submitted to BNL procurement.
>    -> Elke: Don't see why the order can not be placed this Month. Need 
> constant follow-up
> 
>    2) Discuss with Fermilab about production module assembly schedule - 
> Zhenyu/Xu
>    -> Zhenyu will provide the contact person info to Elke so that she can 
> ask for and understand the spendings on prototypes, and estimates for the 
> production
> 
>    Prototype Module test:
>    1) Gavin: compared different hit reconstruction threshold and time bin 
> requirements using data taking with FST03 (both inner and outer). Found 
> consistent results as FST01 (outer sensor only)
> 
>    Software:
>    1) Develop FST slow simulator to study tracking performance - 
> Gavin/Shenghui/Daniel
>    -> Shenghui: no statistically significant difference in pT resolution 
> between fast and slow simulators. Will further check. 
>    2) Prepare FST fast simulator code for Review - Shenghui
>    -> Done. 
> 
>    **** Action items ****
>    Integration:
>    1) Design the cooling lines, and cable trays between disks and cooling 
> manifold - Felix/Rahul
>    2) Cooling rack refurbishment and test - Rahul
>    3) Installation procedure and tolerance requirements - Rahul/Yi/Zhenyu
>    4) Survey procedure and requirements - Rahul
>    5) Prepare documents for prelim safety review with C-AD - all
> 
>    Mechanical structure:
>    1) Document the proposed changes to the mechanical structure - Yi
>    2) Test and examine the new assembly procedure - Yi
>    3) Use thermal camera to check air bubbles for hybrid mounting - Yi
>    4) Add flux-cleaning step in the document - Yi
>    5) Document the mechanical structure and hybrid assembly QC criteria - Yi
> 
>    Hybrid/T-board/Inner Signal Cable/Patch Panel Board/Back of Crate Board:
>    1) Update the T-board design to avoid the conflict with Mechanical 
> structure - Jianing/Maowu/Gerard
>    2) Check how T-board would mount onto MS, and fix cables - 
> Jianing/Maowu/Mike/Gerard 
>    3) Look into splitting the inner and outer sensor HV bias - 
> Mike/Gerard/Christian 
>    4) Send the problematic prototype cable-T-board assembly to Mike for 
> investigation - Zhenyu/Mike
>    5) Develop the QC procedure for Inner cable and T-board assembly - 
> Mike/Maowu
> 
>    Production Module assembly:
>    1) Discuss with Fermilab about production module assembly schedule - 
> Zhenyu/Xu
>    2) Design and fabricate module storage boxes for production at UIC - 
> Xu/Andres
>    3) Duplicate the module assembly tooling at UIC - Xu/Zhenyu
> 
>    Prototype Module test:
>    1) Look into the overall large CMN noise, and the abnormal noise of few 
> channels first appear in the readout - Gerard/Xu
>    2) Check the FST noise performance at high readout rate - Xu
>    3) Use the laser test stand to characterize prototype module performance 
> - Andres/Zhenyu
>    4) Test stand setup at BNL - Prithwish/Hu
> 
>    Software:
>    1) Prepare FST offline software - Shenghui/Xu
>    2) Detector slow control - Xu
>    3) Cooling system slow control - Prithwish/Hu
> 
>> On Aug 14, 2020, at 9:42 PM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
>> 
>> Dear all, 
>> 
>> We will have the Weekly FST meeting on Monday starting at 9am EST (BNL 
>> local time). 
>> 
>> Bluejeans Meeting URL https://bluejeans.com/101020434
>> Meeting ID: 101 020 434
>> 
>> https://drupal.star.bnl.gov/STAR/event/2020/08/17/star-forward-silicon-tracker-meeting
>> 
>> 0. follow-ups on review and action items * 
>> 1. Integration                                                             
>>         by Rahul Sharma, Felix Archampong
>> 2. Hybrid, T-board                                                         
>> by Maowu Nie, Gerard Visser 
>> 3. Patch panel boards and ABC boards                       by Mike 
>> Capotosto, Gerard Visser 
>> 4. Simulation Studies                                                    
>> by Shenghui Zhang
>> 5. Prototype Module Test                                              by 
>> Xu Sun, Gavin Wilks
>> 6. Mechanical structure                                                 by 
>> Yi Yang
>> 
>> * 
>> https://drupal.star.bnl.gov/STAR/event/2020/08/17/star-forward-silicon-tracker-meeting/follow-review-and-action-items
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