Star-fst-l mailing list

["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Minutes

Update on action items:

Integration:
1) Cooling rack refurbishment and test - Rahul
-> Rahul: tried a few things, pumps still tripping in every 10 mins, 
Mike/Chrisitian will look into the electric relay for the pumps

2) Design the cooling lines, and cable trays between disks and cooling 
manifold - Felix/Rahul
3) Installation procedure and tolerance requirements - Rahul/Yi/Zhenyu
4) Survey procedure and requirements - Rahul
-> Rahul/Felix: finishing up the 3D model by the end of the week. Then will 
take a couple of weeks to do detailed drawings and tolerance analysis, and 
talk to survey group to get how precise we can know the positions of disks

5) Prepare documents for prelim safety review with C-AD - all
-> Flemming will find and send the slides for IST cables, hybrids, 
-> Mike/Gerard will follow up on cables
-> Maowu/Yi: hybrid, T-board, PEEK, cooling tubes, glues used to glue hybrids 
and MS: provide materials, data sheets, flammability

Mechanical structure:
1) Document the proposed changes to the mechanical structure - Yi
-> will increase the total pin length by 1.5 mm, including an extension to 
the lead by 0.5 mm, will update the document with the latest changes
2) Test and examine the new assembly procedure - Yi
-> looks ok, training the people, update the document after the meeting
3) Use thermal camera to check air bubbles for hybrid mounting - Yi
-> still working on it

4) Add flux-cleaning step in the document - Yi
5) Document the mechanical structure and hybrid assembly QC criteria - Yi

Hybrid/T-board/Inner Signal Cable/Patch Panel Board/Back of Crate Board:
1) Sign-off on hybrids - Jianing/Maowu/Gerard
->Gerard/Mike will take a look at the design today

2) Update the T-board design to avoid the conflict with Mechanical structure 
- Jianing/Maowu/Gerard
-> tolerance contributions: MS, hybrid, connector on hybrid, connector on 
T-board
-> Yi will ask soldering company about the connector position tolerance 
-> Yi will measure FST05 to understand the tolerance and conflict of 
capacitors with MS
-> Yi adding a fit test step for T-board/Hybrid before and after mounting the 
hybrids onto MS

3) Check how T-board would mount onto MS, and fix cables - 
Jianing/Maowu/Mike/Gerard/Rahul
-> Rahul will assess whether the four holes on the T-boards are needed

4) Look into splitting the inner and outer sensor HV bias - 
Mike/Gerard/Christian 
5) Send the problematic prototype cable-T-board assembly to Mike for 
investigation - Zhenyu/Mike
6) Develop the QC procedure for Inner cable and T-board assembly - Mike/Maowu

Production Module assembly:
1) Discuss with Fermilab about production module assembly schedule - Zhenyu/Xu
2) Design and fabricate module storage boxes for production at UIC - Xu/Andres
3) Duplicate the module assembly tooling at UIC - Xu/Zhenyu

Prototype Module test:
1) Look into the overall large CMN noise, and the abnormal noise of few 
channels first appear in the readout - Gerard/Xu
-> more noisy than IST, plan on a visit to UIC by Gerard in the next week

2) Check the FST noise performance at high readout rate - Xu
-> pedestal runs at 10 Hz, 1 kHz, 3kHz

3) Use the laser test stand to characterize prototype module performance - 
Andres/Zhenyu
4) Test stand setup at BNL - Prithwish/Hu

Software:
1) FST Fast/Slow Simulator - Shenghui
2) Prepare FST offline software - Shenghui/Xu
3) Detector slow control - Xu
4) Cooling system slow control - Prithwish/Hu

> On Aug 21, 2020, at 11:45 AM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
> 
> ******************NEW MEETING TIME****************
> 
> Dear all, 
> 
> We will have the Weekly FST meeting on Monday starting at 8:30am EST (BNL 
> local time). 
> 
> Bluejeans Meeting URL https://bluejeans.com/101020434
> Meeting ID: 101 020 434
> 
> https://drupal.star.bnl.gov/STAR/event/2020/08/24/star-forward-silicon-tracker-meeting
> 
> 0. follow-ups on review and action items * 
> 1. Safety pre-approval materials          
> 2. Integration                                                              
>         by Rahul Sharma, Felix Archampong
> 3. Hybrid and T-board                                                       
> by Maowu Nie, Jianing Dong
> 4. Patch panel boards and ABC boards                        by Mike 
> Capotosto, Gerard Visser 
> 5. Mechanical structure                                                 by 
> Yi Yang
> 6. Simulation Studies                                                    by 
> Shenghui Zhang
> 
> * 
> https://drupal.star.bnl.gov/STAR/event/2020/08/24/star-forward-silicon-tracker-meeting/follow-action-items
> 
> Zhenyu
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