Star-fst-l mailing list

[Gavin Wilks <gwilks3 AT uic.edu>]

Hello All, 

We are going to begin tracking the steps of FST module production through the use of ELOG. The ELOG can be found here: http://leto.phy.uic.edu:8080/

There are two separate directories. A new FST directory and the old IST directory. If you would like to get a better idea of how we will be using ELOG, I encourage you to look through the old IST logs, specifically IST04. 

The steps for production are listed below. Some of these steps could be combined assuming the production goes smoothly for the first several Modules.

1.      Mount module on inner support plate

2.      Mount inner readout chips

3.      Wire-bonding pull test

4.      Inner chip back-end bonding

5.      Chip readout test after mounting inner readout chips

6.      Mount module on outer support plate

7.      Mount outer readout chips

8.      Outer chip back-end bonding

9.      Chip readout test after mounting outer readout chips

10.  Mount outer sensors

11.  Outer chip front end bonding

12.  Chip readout test after wire-bonding outer readout chips

13.  Mount inner sensor

14.  Inner chip front-end bonding

15.  Chip readout test after wire-bonding inner readout chips

16.  Wire-bond encapsulation

17.  Survey

18.  Chip readout test after survey

19.  Chip readout test before shipping to BNL

20.  Chip readout test before installation

 

·         Repair

·         Transit

·         General

If there are any suggestions or comments regarding these steps please let me know.

Best Regards,

Gavin Wilks