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  • From: Gerard Visser <gvisser AT indiana.edu>
  • To: star-fst-l AT lists.bnl.gov
  • Subject: Re: [Star-fst-l] FST03
  • Date: Thu, 9 Jul 2020 16:07:22 -0400

hi Zhenyu,
I am wondering whether this (and your prior comment also from the tech(?) "adhesion under some pads was not so good and created some issue but she got all in adjusting the powers") might be related to regions betweeen the structure and the hybrid which are not filled with epoxy but rather are air pockets? Recall, the IST hybrid and structed were bonded I believe in a vacuum bag. As near as I can tell, the procedures for the FST are _quite_ different.
There may be some reliability concerns, if the assembly locally on some bond pads is not rigid enough to wire bond consistently optimally. I do not know but there may also be some risks of damage to sensor if it deflects too much under the wirebonding force. The latter may be a small risk, the former I am not sure is allowable.
Sincerely,

Gerard


On 7/9/2020 3:54 PM, Zhenyu Ye wrote:
The inner and outer sensors were mounted and wire-bonded on FST03. A comment from
the technicians "bias bonds went in but noticed some deflection of the
sensor”, which I think is related to the flatness of the hybrid surface.

We have been taking cosmic data with FST Inner sensor and IST staves since
Tuesday afternoon at UIC. Xu is taking STAR shifts but has managed to find
time to analyze the data but so far so good. Will send out results later.

Zhenyu

On Jul 2, 2020, at 7:45 PM, Yi Yang <yiyang AT ncku.edu.tw> wrote:

Hi Zhenyu,

Thanks a lot for the feedback, we will discuss the possible reason for this
shifting.
My first guess is the mismatch of the CAD files. We will get it back to you
later.

Cheers,
Yi

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web:
https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!XXw41843jdZ_SJh6LgtKNd0CB3nnMZGPftwC4s_ENf3ONF01oRNicwlP_SSCVZ8dXgIM-AA$
+++++++++++++++++++++++++++++++++++++++++++++++++++


On Thu, Jul 2, 2020 at 11:50 PM Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:

On Jul 2, 2020, at 2:40 AM, Yi Yang <yiyang AT ncku.edu.tw> wrote:

Hi Zhenyu,

It is good news. Thanks for the update.

Could you please provide more details on the comments from the technician,
like the placement is off in which direction, what are the reference points
for these 500 and 200 microns (they are very different from our measurements).
"The inner chip placement was off .500mm so I needed to reposition. The outer
placement was off .200mm”.

"They were inboard toward the sensor area . I needed to slide the chips back
or outward. Michelle mention adhesion under some pads was not so good and created
some issue but she got all in adjusting the powers.”

Yi, Han-Sheng, Pu-Kai, do you have the measurement results on the relative x
and y positions of the hybrids w.r.t. mounting holes, and compare them with
design?

==> We actually discussed this in our internal meeting, but so far we don't
know how to measure the relative x and y positions. Pu-Kai and Han-Sheng are
still working on this. But we didn't measure this for FST003. (Pu-Kai and
Han-Sheng, please correct me if I said something stupid...)

Cheers,
Yi

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web:
https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!XXw41843jdZ_SJh6LgtKNd0CB3nnMZGPftwC4s_ENf3ONF01oRNicwlP_SSCVZ8dXgIM-AA$
+++++++++++++++++++++++++++++++++++++++++++++++++++


On Thu, Jul 2, 2020 at 7:53 AM Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
All the 8 APV chips were mounted and showed normal behavior in readout. I
have instructed the Fermilab technicians to mount the Silicon sensors.

One comment from the technician "The inner chip placement was off .500mm so I
needed to reposition. The outer placement was off .200mm”.

Yi, Han-Sheng, Pu-Kai, do you have the measurement results on the relative x
and y positions of the hybrids w.r.t. mounting holes, and compare them with
design?

Best,
Zhenyu

On Jun 19, 2020, at 7:18 AM, Yi Yang <yiyang AT ncku.edu.tw> wrote:

Dear all,

We've finished the second prototype and shipped it to Fermilab directly per
Zhenyu's request today. The DHL tracking number is: 4658055916
(https://urldefense.com/v3/__https://www.dhl.com/en/express/tracking.html?AWB=4658055916&brand=DHL__;!!P4SdNyxKAPE!XXw41843jdZ_SJh6LgtKNd0CB3nnMZGPftwC4s_ENf3ONF01oRNicwlP_SSCVZ8dh6CO4qA$
)

Please find some details/pictures of this prototype here:
20200619_FST_Second_Prototype_YiYang.pdf

Overall it looks pretty good (much better than the first batch).
Thank you very much for being patient with us.

Cheers,
Yi




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