Star-fst-l mailing list

["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Dear all,

I think the review went smoothly yesterday. Thanks for all the hard work. I 
think we were able to answer most of the questions from the committee and 
also received very helpful suggestions from them. The committee is now 
working on the report, which will be distributed later this week. 

Below are some notes I took from the review. Please feel free to comment or 
add.

*************************************
Mechanical structure: 
Use thermal camera with cooling applied to the other side of the mechanical 
structure to check if there is air trapped between hybrid and MS
Add an explicit step in the document/traveller to clean the flux after 
components mounting on the hybrid
Add details about criteria of acceptance/rejection into traveller 
Send bare modules to US as soon as they are produced and certified 

T-board:
Check the updated T-board design as soon as new T-boards are produced

Module assembly/test at FNAL/UIC:
Find a better (clear) way to present the efficiency and clarify the KPP 
requirements 
Optimize the production plan to create float: have two production lines, 
start module assembly with APV chips when the bare modules are available 

Mechanical integration:
Find out the flatness requirement for mounting modules onto the support 
structure?
Define the tolerance requirement for installation and survey 
Ground the cooling tube and supporting structure
Add handles and pieces to the installation tooling to make it easier to grab 
if needed during installation 
*************************************

Below I also list the action items from previous weeks, as well some new ones 
which appear from the discussions in the last few weeks

*************************************
1) Design and fabricate light-tight box for the DAQ integration test at BNL - 
Rahul/Flemming
2) Design the cooling lines, and cable trays between disks and cooling 
manifold - Felix/Rahul
3) Finalize how to mount modules onto the half-rings, and half-rings onto 
support structure, and document the proposed changes to the mechanical 
structure - Rahul/Yi/Zhenyu
4) Design and fabricate module storage boxes for production at UIC - Xu/Andres
5) Duplicate the module assembly tooling at UIC - Xu/Zhenyu

6) Update the T-board design to avoid the conflict with Mechanical structure 
- Jianing 
7) Look into the possibility to split the inner and outer sensor HV bias - 
Mike/Gerard/Jianing 
8) Send the problematic prototype cable-T-board assembly to Mike for 
investigation - Zhenyu/Mike
9) Develop the QC procedure for Inner cable and T-board assembly - Mike/Maowu

10) Look into the overall large CMN noise, and the abnormal noise of few 
channels first appear in the readout - Gerard/Xu
11) Check the FST noise performance at high readout rate - Xu/Zhenyu
12) Sett up the laser test stand to characterize prototype module performance 
- Andres/Zhenyu
13) FST slow simulator with efficiency/resolution measured with prototypes 
and study tracking performance - Gavin/Shenghui 
*************************************

Let’s discuss about all these at the FST meeting next Monday. Hopefully we 
will have the committee’s report by then.

https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting

Best,
Zhenyu