Star-fst-l mailing list

["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Hi Maowu, 

It is the outer section side of the T-board that has conflict. 

Zhenyu

> On Aug 4, 2020, at 9:58 PM, nie <nie AT rcf.rhic.bnl.gov> wrote:
> 
> Hi Zhenyu,
> 
> I think we all agree to move the capacitor to the other side at current 
> stage.
> Can you provide more information about the conflict? Like top layer or 
> bottom layer?
> These information will be helpful for us.
> 
> Thanks,
> Maowu
> 
> 
> 在 2020-08-04 23:55，Gerard Visser 写道：
>> hi Zhenyu,
>>      A few comments below. Thanks,
>>              Gerard
>> On 8/4/2020 11:48 AM, Ye, Zhenyu wrote:
>>> Dear all,
>>> I think the review went smoothly yesterday. Thanks for all the hard work. 
>>> I think we were able to answer most of the questions from the committee 
>>> and also received very helpful suggestions from them. The committee is 
>>> now working on the report, which will be distributed later this week.
>>> Below are some notes I took from the review. Please feel free to comment 
>>> or add.
>>> *************************************
>>> Mechanical structure:
>>> Use thermal camera with cooling applied to the other side of the 
>>> mechanical structure to check if there is air trapped between hybrid and 
>>> MS
>> We may expect there will be air pockets. What is the action to take?
>> Are we expecting to develop some criteria on where there must not be
>> air pockets, or on size of air pockets?
>>> Add an explicit step in the document/traveller to clean the flux after 
>>> components mounting on the hybrid
>>> Add details about criteria of acceptance/rejection into traveller
>>> Send bare modules to US as soon as they are produced and certified
>>> T-board:
>>> Check the updated T-board design as soon as new T-boards are produced
>> Also, see below.
>>> Module assembly/test at FNAL/UIC:
>>> Find a better (clear) way to present the efficiency and clarify the KPP 
>>> requirements
>>> Optimize the production plan to create float: have two production lines, 
>>> start module assembly with APV chips when the bare modules are available
>>> Mechanical integration:
>>> Find out the flatness requirement for mounting modules onto the support 
>>> structure?
>>> Define the tolerance requirement for installation and survey
>>> Ground the cooling tube and supporting structure
>> We should probably do this by a local connection to the T-board. Let's
>> identify a suitable way and add this possibility in T-board revision
>> which is happening anyway now. It was done similarly on IST I believe
>> (actually on hybrid there but T-board more appropriate here in FST I
>> think, certainly because the hybrid designs should be considered
>> frozen now.
>>> Add handles and pieces to the installation tooling to make it easier to 
>>> grab if needed during installation
>>> *************************************
>>> Below I also list the action items from previous weeks, as well some new 
>>> ones which appear from the discussions in the last few weeks
>>> *************************************
>>> 1) Design and fabricate light-tight box for the DAQ integration test at 
>>> BNL - Rahul/Flemming
>>> 2) Design the cooling lines, and cable trays between disks and cooling 
>>> manifold - Felix/Rahul
>>> 3) Finalize how to mount modules onto the half-rings, and half-rings onto 
>>> support structure, and document the proposed changes to the mechanical 
>>> structure - Rahul/Yi/Zhenyu
>>> 4) Design and fabricate module storage boxes for production at UIC - 
>>> Xu/Andres
>>> 5) Duplicate the module assembly tooling at UIC - Xu/Zhenyu
>>> 6) Update the T-board design to avoid the conflict with Mechanical 
>>> structure - Jianing
>>> 7) Look into the possibility to split the inner and outer sensor HV bias 
>>> - Mike/Gerard/Jianing
>>> 8) Send the problematic prototype cable-T-board assembly to Mike for 
>>> investigation - Zhenyu/Mike
>>> 9) Develop the QC procedure for Inner cable and T-board assembly - 
>>> Mike/Maowu
>>> 10) Look into the overall large CMN noise, and the abnormal noise of few 
>>> channels first appear in the readout - Gerard/Xu
>>> 11) Check the FST noise performance at high readout rate - Xu/Zhenyu
>>> 12) Sett up the laser test stand to characterize prototype module 
>>> performance - Andres/Zhenyu
>>> 13) FST slow simulator with efficiency/resolution measured with 
>>> prototypes and study tracking performance - Gavin/Shenghui
>>> *************************************
>>> Let’s discuss about all these at the FST meeting next Monday. Hopefully 
>>> we will have the committee’s report by then.
>>> https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting
>>> Best,
>>> Zhenyu
>>> _______________________________________________
>>> Star-fst-l mailing list
>>> Star-fst-l AT lists.bnl.gov
>>> https://lists.bnl.gov/mailman/listinfo/star-fst-l
>> _______________________________________________
>> Star-fst-l mailing list
>> Star-fst-l AT lists.bnl.gov
>> https://lists.bnl.gov/mailman/listinfo/star-fst-l
> _______________________________________________
> Star-fst-l mailing list
> Star-fst-l AT lists.bnl.gov
> https://lists.bnl.gov/mailman/listinfo/star-fst-l