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[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

> On Dec 12, 2019, at 6:00 PM, Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
> 
> 3. Mechanical structure - Yi
> 3rd version of mechanical structures were delivered by EASTON. The changes 
> w.r.t. v2 includes 1) a new type of PEEK+30% CF material that flow better 
> during injection and thus less bending than the old type material 2) remove 
> the center part of the outer region. The data from one set of the 
> structures indicates bending around 500 and 700 microns for inner and outer 
> region structures, respectively. The former seems to be worse than the 
> previous version and Yi will try to find out the explanation from EASTON. 
> Moving forward, Yi is going to ask EASTON to increase the thickness of the 
> structure from 1.5mm to 2mm, which EASTON expects to improve the bending 
> issue. This will take 1.5-2 weeks to see the results. Yi will also discuss 
> with AIDC next Monday is to add CF sheets to increase the stiffness and 
> thus improve the surface flatness. Yi agreed that we will have a meeting to 
> discuss his findings next Monday 3:30pm BNL time.

https://drupal.star.bnl.gov/STAR/event/2019/12/16/star-forward-silicon-tracker-meeting

> Han-Sheng is working on a new Thermal-Stress simulation with the latest 
> design, and may report next week.