Star-fst-l mailing list

[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Attendees: Han-Sheng, Xu, Yi, Zhenyu

Mechanical structure - Yi
1) increase the thickness from 1.5 to 2mm, may achieve 200 micron flatness 
(will get the result on Friday). If so, glue layer between hybrid and 
structure can be used to improve further to 100 micron. 
2) remove carbon fiber to increase the flow rate
3) add carbon fiber sheet?
4) change the shape/thickness of the ribs
 
Gluing jig status - Yi
AIDC is working on the design 
 
Schedule - Yi
Jan 3, assuming mounting hybrids
Jan 4-10, AIDC glue mechanical structure and hybrids 
Jan 15, send to UIC

Storage box
NCKU will design and make a few boxes for prototype modules. Yi will discuss 
with Han-Sheng about the current design

> On Dec 16, 2019, at 8:43 AM, Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
> 
> 
>> On Dec 12, 2019, at 6:00 PM, Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
>> 
>> 3. Mechanical structure - Yi
>> 3rd version of mechanical structures were delivered by EASTON. The changes 
>> w.r.t. v2 includes 1) a new type of PEEK+30% CF material that flow better 
>> during injection and thus less bending than the old type material 2) 
>> remove the center part of the outer region. The data from one set of the 
>> structures indicates bending around 500 and 700 microns for inner and 
>> outer region structures, respectively. The former seems to be worse than 
>> the previous version and Yi will try to find out the explanation from 
>> EASTON. 
>> Moving forward, Yi is going to ask EASTON to increase the thickness of the 
>> structure from 1.5mm to 2mm, which EASTON expects to improve the bending 
>> issue. This will take 1.5-2 weeks to see the results. Yi will also discuss 
>> with AIDC next Monday is to add CF sheets to increase the stiffness and 
>> thus improve the surface flatness. Yi agreed that we will have a meeting 
>> to discuss his findings next Monday 3:30pm BNL time.
> 
> https://drupal.star.bnl.gov/STAR/event/2019/12/16/star-forward-silicon-tracker-meeting
> 
>> Han-Sheng is working on a new Thermal-Stress simulation with the latest 
>> design, and may report next week. 
> 
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