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Chronological Thread  
  • From: "Kiselev, Alexander" <ayk AT bnl.gov>
  • To: Pierrick Dinaucourt <pdinaucourt AT omega.in2p3.fr>, Gábor Nagy <hunagabo AT gmail.com>, "Cacace, Daniel" <dcacace AT bnl.gov>, Miklos Czeller <miklos.czeller AT mediso.com>
  • Cc: "Camarda, Timothy via Eic-projdet-pfrich-electronics-l" <eic-projdet-pfrich-electronics-l AT lists.bnl.gov>
  • Subject: Re: [Eic-projdet-pfrich-electronics-l] Final modifications to the V0 FPGA board
  • Date: Fri, 24 Nov 2023 14:36:31 +0000

  Dear Pierrick,

  Very good news! Daniel, Tim: once you are back from the long weekend holidays (Monday), will you have time to have a quick look through the 3D model consistency and the schematics overall? Tim, be aware that this board will be ordered in France. Gabor, please also have a look, in particular let's verify that the Samtec connector pin-out is now identical in both FMC and ASIC boards.

  Pierrick, few comments / questions:

  (1) I understand, you are going to order the boards about Tuesday next week? How many and how many ASICs are we really going to expend on this iteration? I'm not sure I understand how big is your "stock". It would be really silly if at the end we run out of ASICs, and cannot find healthy 80 ones we need for V1

  (2) see attached. I believe the Y-coordinates of some of the highlighted holes are not indicated. 3.5mm seems to be about right as a distance to the HV holes

  (3) the assembly "video" is a bit misleading: there will be no heat sink in case of the FMC board, because of the conflict with a Twinax cable

  (4) can you provide a drawing indicating ASIC 0..7 mapping in both halves? we will need it at some point anyway. Right now the legend still says M1..M16

  I'm going to distribute r15 of the interface document over the weekend after having incorporated all the recent feedback.

  Cheers,
    Alexander.
 

From: Pierrick Dinaucourt <pdinaucourt AT omega.in2p3.fr>
Sent: Friday, November 24, 2023 6:01 AM
To: Kiselev, Alexander <ayk AT bnl.gov>; Gábor Nagy <hunagabo AT gmail.com>; Cacace, Daniel <dcacace AT bnl.gov>; Miklos Czeller <miklos.czeller AT mediso.com>
Cc: Camarda, Timothy via Eic-projdet-pfrich-electronics-l <eic-projdet-pfrich-electronics-l AT lists.bnl.gov>
Subject: Re: Final modifications to the V0 FPGA board
 

Dear All,


this is a new link here to download many documents about the Hrppd_Asic_board_v0 :


https://mycore.core-cloud.net/index.php/s/77fHP7AvPFCutzt


and the new final step file (no change for mechanics):


https://mycore.core-cloud.net/index.php/s/TGg0jHv4MlcwtZy


Regards


Pierrick


Le 21/11/2023 à 10:28, Pierrick Dinaucourt a écrit :

Dear Alexander,


for me it's ok, the design is over. I check the last point and I'm speaking with the manufacturer to correct some details. I'll share with you the documents, Gerber, schema and step asap.


The order will be send this week and after it's 3 weeks to have the PCB. We think also for the assembly and the number of Asic we need. I'm not sure we can provide more than 50 Asics actually now. With this we can do one complete card with 16 asics, 2 others with 8 asics and 4 cards with 4 asics.


Regards


Pierrick


Le 21/11/2023 à 03:13, Kiselev, Alexander a écrit :
  Dear All,

  now that the FMC board purchase order request is placed in the system here at BNL (and the manufacturer actually started the EQ procedure with us), let's turn back to the other three parts of the V0 configuration:

  (1) Pierrick, when do you think you can be ready with the ASIC board design?

  (2) Gabor, Daniel and Miklos: since adding thermistors to the ASIC board is pretty much excluded in V0 iteration (it better be out for manufacturing as soon as ready), can we do a meaningful test of this safety feature functionality mounting them onto the FPGA board? Will we need them also on the FPGA board in V1? Then what model, how many and where? As to the V1, Daniel would like to place at least one per a pair of ASICs (if not one per ASIC). Will we have enough pins in Samtec connectors to allow for this in V1 iteration, at all?

  (2a) Gabor, what are your current timelines to finish the FPGA board? Do we still need to discuss anything substantially new other than the cooling system interface?

  (3) Daniel, Gabor: are we all clear about the layout of the additional FPGA cooling plates with fins? Or we wait until Daniel has time to distribute a complete cooling setup model? Gabor, do you have a preliminary CAD model of the FPGA board, to help Daniel?

  (3a) Daniel: are we going to provide power to the fan in V0 via a separate cable?

  Cheers,
    Alexander.



-- 
Pierrick Dinaucourt
PCB Designer
Laboratoire OMEGA
Unité CNRS-Polytechnique
tél: 01-69-33-89-83
-- 
Pierrick Dinaucourt
PCB Designer
Laboratoire OMEGA
Unité CNRS-Polytechnique
tél: 01-69-33-89-83

Attachment: asic-board-holes.pdf
Description: asic-board-holes.pdf




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