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  • From: Christophe de La Taille <taille AT in2p3.fr>
  • To: Tonko Ljubicic <tonko AT bnl.gov>
  • Cc: eic-projdet-pfrich-electronics-l AT lists.bnl.gov
  • Subject: Re: [Eic-projdet-pfrich-electronics-l] Temperature monitoring in V0 & V1
  • Date: Tue, 28 Nov 2023 16:04:32 +0100

dear Tonko,

thanks for your message, I am sorry I was not aware of this development and we can certainly take into account when we make an iteration of the testboards and also for the next series of chips.  As we are not designing here the FPGA boards here at OMEGA, this is probably more addressed to the readout side, but we'll adapt to the FMC pinout recommendations.   Best regards : Christophe

On 28/11/2023 15:29, Tonko Ljubicic wrote:
Hello,

I'm new to this mailing list so perhaps this was discussed before.

In short: we are designing an RDO Prototype which is expected to be
of value to all frontend groups. We would like to make it as generic as
possible
and to do that we added a FMC connector so that we can readout various
frontend ASICs in the manner we all currently use FPGA development kits.

Looking at the already existing ASIC test cards (e.g. EICROC0, H2GCROC, etc)
we noticed a lot of (unsurprising) pin clashes on the FMC connector which made
it practically impossible to use the RDO Prototype with all of them.

What I am after (and I talked to Miklos, for example) is a unified approach
to the FMC pinouts and (if lucky) signal standards. The only really critical
pins are the clocks going _into_ your testboards because they will be fed
directly by very low jitter PLLs from my RDO Prototype so I can't just
"reprogram" them depending on various boards.

What do you think? I can give you a short presentation with the details
if anyone cares.

-- Tonko


On Tue, Nov 28, 2023 at 1:58 PM Christophe de La Taille via
Eic-projdet-pfrich-electronics-l
<eic-projdet-pfrich-electronics-l AT lists.bnl.gov> wrote:
dear Alexander,

the chips can operate without problems at 50°C or more, we may also use
parameters that reduce the power dissipation (no ToT...).

Discussing with Pierrick here, we propose to fisrt assemble 3PCBs : one with
2 chips, one with 4 and one with 8, essentially for the power and digital
tests. The ones with 2 and 4 chips will focus on the noise and the timing
performance.

Best : Christophe



On 27/11/2023 21:20, Kiselev, Alexander via Eic-projdet-pfrich-electronics-l
wrote:

Hi Gabor,

There are few remaining questions related to the temperature monitoring in
this V0 iteration:

(1) can we add at least one permanently mounted temperature sensor (on the
FPGA board), provisions to attach at least one remote sensor (placed next to
one of the ASICs), and some minimal I2C circuitry to handle those by FPGA, in
order to get a feeling of how this all will look in V1?

(2) can you point Daniel to other expected hot spots on the FPGA board
(say related to power convertors, ethernet-related circuitry, etc)?

Also, Christophe, Pierrick: remind us please, what is the safe temperature
range we are going to operate the ASICs?

Cheers,
Alexander.


--
--
Christophe de LA TAILLE
OMEGA CNRS/IN2P3 Micro-Electronics Design Lab
Professor of micro-electronics at Ecole Polytechnique
Ecole Polytechnique F91128 Palaiseau France
+33 16933 8998

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--
--
Christophe de LA TAILLE
OMEGA CNRS/IN2P3 Micro-Electronics Design Lab
Professor of micro-electronics at Ecole Polytechnique
Ecole Polytechnique F91128 Palaiseau France
+33 16933 8998





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