Star-fst-l mailing list

[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Gerard, thanks for looking into this.

> On Nov 7, 2019, at 11:48 PM, Gerard Visser <gvisser AT indiana.edu> wrote:
> 
> hi Jianing,
>       I checked the schematics
> 
> outer hybrid
> https://drupal.star.bnl.gov/STAR/system/files/hybrid_outer_v2_3-schematic_0.pdf
> 
> inner hybrid
> https://drupal.star.bnl.gov/STAR/system/files/hybrid_inner_v2_1-schematic.pdf
> 
> T-board
> https://drupal.star.bnl.gov/STAR/system/files/T-Board_v3-schematic.pdf
> 
>       I think everything looks correct in these. One minor point is that we 
> probably have to change the resistor values (on T-board and on hybrids) to 
> have less reflection on the CLK and TRG lines. The cable has a 
> characteristic impedance (differential) of around 100 to 110 Ohms. (It 
> isn't very precisely controlled, we should measure it when we have the 
> cable, but it will be around that value. So we should make the input 
> impedance of T-board and hybrids assembly around 100-110 Ohms. I suggest 
> changing the resistors R1, R2 on outer hybrid and on inner hybrid from 49.9 
> to 78.7 Ohm,

Jianing, if the proposed changes are fine to you. can you please update the 
hybrids schematics accordingly? 

Yi, I understand that a company has assembled 6 inner hybrids w/o obvious 
issue, but with the 49.9 Oh for R1/R2. Can they change them?

> and the leaving the resistors R9, R10, R11, R12 on the T-board at 33.2 Ohm. 
> Final values have to be confirmed after all the boards and cable are 
> available for a scope measurement. At that time we _might_ decide to change 
> the value on T-board; the 78.7 Ohm on hybrids is very likely to be fine 
> (and is of course a lot more trouble to modify on existing boards, so we 
> won't want to do that).
>       [FYI in IST from the documents at 
> https://drupal.star.bnl.gov/STAR/blog/yezhenyu/forward-silicon-tracker-ist 
> the naively calculated input impedance 166 Ohms which is not right. I am 
> not sure why, perhaps the documents are not really all correct. I think Ben 
> did look at CLK & TRG waveforms with a scope and optimize these, although I 
> don't have any record of it.]
>       I will have a look at new outer hybrid layout for electrical / layout 
> issues only -- not for mechanical interface issues -- but I expect no 
> problems, it will look nice as the prior version did.

Gerard, it will be great if you can look at the new outer hybrid layout for 
electrical / layout issues asap, so that we can move forward with the new 
hybrid production. This has now become the bottleneck of the project. 

Best,
Zhenyu


>       Thanks,
> 
>               Gerard
> 
> 
> On 10/31/2019 10:22 PM, 董家宁 wrote:
>> Hi Gerard,
>>   Thanks for your help.
>>   There are no changes on the connector part.
>>   Please let me know if you need any other files.
>>   Thanks!
>> Best,
>> Jianing
>>> -----原始邮件-----
>>> 发件人: "Gerard Visser" <gvisser AT indiana.edu>
>>> 发送时间: 2019-11-01 10:14:39 (星期五)
>>> 收件人: star-fst-l AT lists.bnl.gov
>>> 抄送:
>>> 主题: Re: [Star-fst-l] Weekly FST meeting - 10/31/2019
>>> 
>>> hi Jianing, Zhenyu,
>>>     Somebody was going to document (simply with a picture or two) how 
>>> that the
>>> connector tab of outer (particularly) hybrid fits well to the T-board on
>>> mechanical structure. I think we should see this before the new outer 
>>> hybrid is
>>> ordered. (Is there any change in this aspect of the new outer hybrid? I
>>> understood no change.)
>>>     Meanwhile, yes it is in my inbox to check the electrical aspects, I 
>>> will try to
>>> have that done by early next week.
>>>     Thanks,
>>> 
>>>             Gerard
>>> 
>>> 
>>> On 10/31/2019 10:04 PM, 董家宁 wrote:
>>>> Dear All,
>>>> 
>>>>    2.Hybrid, T-board:
>>>> 
>>>>    With the help of Mike and Gerard,  the address connection for the 
>>>> temperature
>>>> sensor chip on outer hybrid is modified and updated.
>>>> 
>>>>    And the schematic for T-board v3.0 is also updated (keep one set of
>>>> temperature sensor and reset circuit).
>>>> 
>>>>    I think they are all waiting for the double check.
>>>> 
>>>>    If there are no other mistakes for outer hybrid layout, it will take 
>>>> about 3
>>>> weeks for the production.
>>>> 
>>>>    All the detailed status are listed on the WIKI
>>>> (https://wiki.bnl.gov/star/index.php/Hybrid_and_T-board).
>>>> 
>>>> 
>>>> Best,
>>>> 
>>>> Jianing
>>>> 
>>>> 
>>>>     -----原始邮件-----
>>>>     *发件人:*"Capotosto, Michael" <capotosto AT bnl.gov>
>>>>     *发送时间:*2019-11-01 05:43:15 (星期五)
>>>>     *收件人:* "Ye, Zhenyu" <yezhenyu AT uic.edu>, "star-fst-l AT lists.bnl.gov"
>>>>     <star-fst-l AT lists.bnl.gov>
>>>>     *抄送:*
>>>>     *主题:* Re: [Star-fst-l] Weekly FST meeting - 10/31/2019
>>>> 
>>>>     All,
>>>> 
>>>>     As discussed last meeting, I’ve compiled the documentation and 
>>>> posted it to
>>>>     the wiki: https://wiki.bnl.gov/star/index.php/Cables
>>>> 
>>>>     T-Board/Inner Signal Cable:
>>>> 
>>>>     Last meeting we agreed we would use the IST-type of cables, due to 
>>>> cost. It
>>>>     turns out I misinterpreted the quote – we were quoted for 400ft of 
>>>> cable but
>>>>     they had a minimum 1,000ft order. It is cheaper as Gerard expected 
>>>> to use
>>>>     the Polypropylene/PVC/PVC cable. I’m waiting to hear back from 
>>>> Gerard on how
>>>>     he’d like to proceed. The updated quotes binder mentioned can be 
>>>> found here:
>>>>     
>>>> https://drupal.star.bnl.gov/STAR/system/files/Cable%20Quotes%20Binder%2010-28-2019.pdf
>>>>     
>>>> <https://drupal.star.bnl.gov/STAR/system/files/Cable%20Quotes%20Binder%2010-28-2019.pdf>
>>>>     The quotes binder also includes new updated (non-expired) quotes, so 
>>>> once we
>>>>     have a decision we can order the cables. (Elke/Gerard/Zhenyu, will 
>>>> this be
>>>>     on one of the BNL accounts, or will I be sending this to someone 
>>>> else? If it
>>>>     will be on a BNL account I can start drafting the PO so it will be 
>>>> ready to
>>>>     send when we make a final decision).
>>>> 
>>>>     Regarding the V2.1 T-Board modifications, I believe we just need to 
>>>> remove a
>>>>     handful of parts to in order to make it work, I’ve discussed this in 
>>>> an
>>>>     email with Jianing and Gerard, and am waiting to hear back from 
>>>> Gerard. I
>>>>     will have the cables re-labeled tonight before I leave (to match the 
>>>> VIA REF
>>>>     DES used in V2.1 T-Boards we are assembling). Once Gerard gives me 
>>>> the O.K.
>>>>     I’ll pull the parts off the boards, and we should be able to give 
>>>> them to
>>>>     the assembler within a working day or two. If there are no 
>>>> objections, I
>>>>     will extend the due date for the vendor to November 29.
>>>> 
>>>>     If I’ve missed any points please let me know.
>>>> 
>>>>     Best,
>>>> 
>>>>           Mike Capotosto
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