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[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Hi Yi

Please find some comments below:

You have already lots of slides. But I think you need the following

Need to list the materials used in the assembly, including the glues, thermal 
grease, and assert whether they meet the ES&H requirements and radiation 
hardness. 
Need to add slide on thermal simulation. 
Need to add one slide on the overall schedule with dates

Slide 2
Inner Signal Cable: BNL -> BNL/IU
Silicon sensor: UIC/SDU/NCKU -> UIC/BNL

Slide 3
Do you want to have a slide after this slide to describe how the main 
structure is produced using the injection mold method?
It seems odd to me that you have a slide on how the cooling tube is made 
(less of a problem) but no slide on the main structure (the main source of 
challenges).

Slide 4
Compared to the previous version, the statement "Plating with Cadmium 
(Chroming) to prevent electrical corrosion” is removed. I would not do it 
just to avoid question from the committee, but try to get the ES&H 
requirements checked before the review.

Slide 6
Goal: quickly produced prototypes for sensor testing -> I am not aware that 
this was the goal. I thought the goal was always to produce good quality 
prototype modules. 
Also do you want to mention that this assembly was done at AIDC?

Slide 7
to assembly -> to assemble

Slide 8, 31, 34
Acceptance:~350±150μm (not a critical point here)
-> This is a bit confusing. The range includes a lower limit of 200 microns. 
We certainly would not reject any parts that have smaller variation in 
surface flatness.
Looking at Slide 31 and 34, which parts are used to assemble FST03, 04 and 05?
I am also not sure it is clear how to interpret "not a critical point here”. 

Slide 27
How long does each step take? Is there enough manpower and machine time to 
cover all the tasks?

Best,
Zhenyu

> On Jul 29, 2020, at 7:19 AM, Yi Yang <yiyang AT ncku.edu.tw> wrote:
> 
> Hi Flemming and all,
> 
> I have updated my slides on the same page: 
> https://drupal.star.bnl.gov/STAR/event/2020/07/27/star-forward-silicon-tracker-meeting/module-mechanical-structure
> 
> Please let me know if you have any comments or suggestions.
> 
> Cheers,
> Yi
> 
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> Yi Yang, Associate Professor 
> Department of Physics 
> National Cheng Kung University 
> Tainan, 701 Taiwan 
> E-Mail: yiyang AT ncku.edu.tw 
> Tel: +886-6-2757575 ext.65237 
> Fax: +886-6-2747995
> Group Web: 
> https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!RCKiVp_4ksoZE1cExFuf-yGRxurA2cNHfLOXYv5v34uNadEKSAhydYnwO1Rv6qcGygQLQp8$
>   
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> 
> 
> On Wed, Jul 29, 2020 at 2:53 AM videbaek <videbaek AT bnl.gov> wrote:
> 
> 
> 
> Hi
> 
> Here are some comments to what should be in the talk: Rahul, Sun, Maowu
> the comments are also in word document
> 
> best
> Flemming
> 
> 
> Assembly UIC/FNAL
> 
> 
> There has to be a slide on the Q&A done during production as we talk 
> about on Monday
> // slide 11
> Test to be performed –
> Amount on time –
> Tracking of outcome (how recorded)
> 
> Check of temperature of APV chips with infrared sensor/camera. With 
> cooled water
> Maybe done at UIC or at BNL -TDB
> 
> Mentioned that this will be repeated when they arrive/assembled in at 
> BNL
> 
> Need a slide that details just in words the step for assembly
> 
> You can keep the summary,
> But on slide before take the assembly tasks – put into a 3 column table 
> with col 2 == time
> (days () , -- also is there no steps for curing time and column 3 with 
> institution/man power
> 
> Repeat the number of assemblies to make; what can be done in parallel
> This is important information to evaluate the 3 months
> 
> --
> Add an ESH slide describing the additional materials used in assembly
> (like glue, epoxy for encapsulation)
> Add statement that you follow UIC guidelines for working safely in the 
> lab.
> 
> 
> 
> Hybrid & T-boards
> 
> Slide 5 ; reformulate the waiting for .. as we discussed.
> I assume we agreed we would not change mechanics for the T-board, but 
> move the capacitor on the board. Add a week for that task, (design + 
> signoff by group)
> 
> You got my estimate for connectors-
> I suggest the make production slide into two
> One for hybrid and one for T-board – you might indicator vendor –
> Based on experience with prototype.
> Give the quantities being made
> 
> One slide with ES&H
> Materials proper (is there a standard that is being followed
> --- non flammable PCB ?
> Work at lab at SDU minimal. Follows University work rules.
> 
> 
> Integration
> 
> Rahul
> 
> Please add a slide on ES&H
> 
> That we follow BNL rules
> There will be safety review (before actual production?)
> Certainly, one before installation
> Any specific concern that you pay attention to on this
> 
> Also if you can add a slide where you discuss your response to Charge 
> questions?
> (Those relevant  like installation schedule)
> 
> 
> 
> 
> 
> -- 
> Flemming Videbaek
> senior scientist
> videbaek @ bnl.gov
> Brookhaven National Lab
> Physics Department
> Bldg 510D
> Upton, NY 11973
> 
> phone: 631-344-4106
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