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[Xu Sun <sunxuhit AT gmail.com>]

Hi Gerard,

Thanks for the suggestion.

I already listed in the sub-bullets the epoxies and encapsulant are used for sensor/chip mounting.

I will try to make it clearer.

Best,

Xu

On Wed, Jul 29, 2020 at 11:45 PM Gerard Visser <gvisser AT indiana.edu> wrote:

hi Xu,
        On slide 16, although it is intended only as an ES&H slide, people might anyway
read too much out of it. Can you make it clearer that you are saying only that
the materials used for APV and sensor installation are same as IST. The
materials used in bonding the hybrid to the structure differ (and if the
reviewers have any technical comment on that, we'd like to know it). Maybe we
don't need or want to draw attention to it but we should avoid a
misunderstanding from a blanket statement "Use the same epoxies and encapsulant
used for IST".

        Gerard


On 7/30/2020 12:08 AM, Xu Sun wrote:
> Hi Flemming,
>
> Sorry for the late reply. Please find my updated slides in the following link:
> https://drupal.star.bnl.gov/STAR/system/files/FstReviewAug2020_v7.pdf
>
> Comments and suggestions are welcome.
>
> Best,
>
> Xu
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