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["Ye, Zhenyu" <yezhenyu AT uic.edu>]

Hi Yi,

Please find some comments/questions below.

Slide 3:
Thermalrigh TF8 2G, Loctite EA 9359.3 AERO, Araldite 2011 -> I remember you 
said the glue you are using have been used for CMS HCAL. Which one(s) are 
these? Can we get the ES&H checked before the review? 

Thermalrigh TF8 2G: rad testing -> Does this mean a test is ongoing?

Slide 4: 
In the thermal simulation, what temperature do you use for NOVEC? Is it 25 
degree C?
In the experiment using cooling water, I guess you put 8 resistors, each 
generating 0.25W, to simulate APVs?

Slide 8:
Goal: quickly produced prototypes for sensor testing 
-> As I wrote in my previous email, I was not aware of this goal. And even 
this was the case, we clearly failed the goal, because we did not test the 
inner sensor until this month. 
-> Do you want to mention the connector issue and now you have added the QA 
step?

Slide 21:
Be prepared to answer questions like, what is the thickness of the glue 
layer, and that of the thermal geese

Slide 22:
(1) Mainly due to the guide pin and this will be fixed after using the 
recommendation from Rahul’s team
-> I am not convinced that the guide pin is the main cause (the statement 
itself is unclear. Reading the sentence, it is unclear what it means by the 
guide pin is the main cause. Moreover, I think besides using bushing+pins, 
you are also going to change the procedure, i.e. to eliminate an intermediate 
step to correlate inner and outer together. You may want to mention both here.

Slide 24:
Is it going to work with bushing with an inner diameter of 6-6.008 and a pin 
with an outer diameter of (6-6.008)?
What if the bushing is at its lower limit 6.000 and pin at its upper limit 
6.008, both are within their tolerance, but pin is larger than the bushing. 
-> I am waiting for the updated slides before asking Fermilab engineers. I 
note the tolerance of your pin is different than the pin we use for module 
assembly. For the latter we use JPLRM4-P6-B10 from 
https://urldefense.com/v3/__https://us.misumi-ec.com/vona2/detail/110302194870/__;!!P4SdNyxKAPE!Wu1oGYWjSseyTuZ6xuriO6MLQzNGu8Tv_7k42L6t86Ly-8BTok_PNcbnqrTK9HtqZwaMQqs$
  

Slide 29:
You are making 60 but we only need 48. Some explanation or adjustment to the 
number/schedule is needed. 

Slide 30:
The last two statements "Some small adjustments are needed”, “Ready to start 
production” seem to contracting each other. Do you mean "Ready to start 
production” on September 9?

Zhenyu

> On Jul 30, 2020, at 10:54 AM, Yi Yang <yiyang AT ncku.edu.tw> wrote:
> 
> Hi,
> 
> Please find the updated version (v3) in the same link 
> (https://drupal.star.bnl.gov/STAR/event/2020/07/27/star-forward-silicon-tracker-meeting/module-mechanical-structure).
> 
> Cheers,
> Yi
> 
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> Yi Yang, Associate Professor 
> Department of Physics 
> National Cheng Kung University 
> Tainan, 701 Taiwan 
> E-Mail: yiyang AT ncku.edu.tw 
> Tel: +886-6-2757575 ext.65237 
> Fax: +886-6-2747995
> Group Web: 
> https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!Wu1oGYWjSseyTuZ6xuriO6MLQzNGu8Tv_7k42L6t86Ly-8BTok_PNcbnqrTK9HtqvBOcfgQ$
>   
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> 
> 
> On Thu, Jul 30, 2020 at 10:22 PM videbaek <videbaek AT bnl.gov> wrote:
> Hi Zhenyu,
> 
> very good, then its all consistent.
> And thanks for the confirmation that they confirm the schdule with the 
> risk due to
> covid and low priority
> 
> best Flemming
> 
> 
> On 2020-07-30 10:14, Ye, Zhenyu wrote:
> > Hi Flemming.
> > 
> >> On Jul 30, 2020, at 8:58 AM, videbaek <videbaek AT bnl.gov> wrote:
> >> 
> >> 
> >> Hi Sun and Zhenyu
> >> 
> >> thanks for the update -
> >> Looks overall good now.
> >> - Please take Gerads comment into account.
> >> 
> >> I have a comment on on the slide 17;
> >> 
> >> between some of the steps at FNAL you will check connectivity before 
> >> going on to the next step as shown on
> >> slide 3. How does this add to the time estimate? Will you bring the 
> >> modules back and forth to UIC?
> > 
> > The time for the module test (0.5 hour/module, shown on slide 8)
> > should not add to the total time, which is dominated by the overnight
> > curing of each gluing step. We plan to set up the test stand at FNAL,
> > and so no back and forth between FNAL/UIC for production.
> > 
> >> In total you have set aside 4 month for the assembly i.e. ~ 88 
> >> workdays so there is about
> >> 2 workdays available per module. Can you confirm.
> > 
> > Below is the initial statement from SiDet manager a few days ago. I am
> > in the process of discussing the technical details (setting up the
> > test stand, making a new assembly tooling set, etc)
> > 
> >>  Yes, i think we can complete this work near your schedule if there 
> >> are no snags or unforeseen circumstances. Please remember that lab 
> >> projects have priority, but we haven’t had too many issues thus far 
> >> except COVID. Rick
> >> 
> >>> On Jul 27, 2020, at 6:22 PM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
> >>> 
> >>> Can you comment on the schedule, i.e., can Bert/Michelle/Gary 
> >>> complete the production of 48 modules in March-June 2021?
> >>> 
> >>> Best
> >>> Zhenyu
> > 
> > Zhenyu
> > 
> >> 
> >> 
> >> 
> >> On 2020-07-30 00:08, Xu Sun wrote:
> >>> Hi Flemming,
> >>> Sorry for the late reply. Please find my updated slides in the
> >>> following link:
> >>> https://drupal.star.bnl.gov/STAR/system/files/FstReviewAug2020_v7.pdf
> >>> Comments and suggestions are welcome.
> >>> Best,
> >>> Xu
> >>> On Tue, Jul 28, 2020 at 1:55 PM videbaek <videbaek AT bnl.gov> wrote:
> >>>> Hi
> >>>> Here are some comments to what should be in the talk: Rahul, Sun,
> >>>> Maowu
> >>>> the comments are also in word document
> >>>> best
> >>>> Flemming
> >>>> Assembly UIC/FNAL
> >>>> There has to be a slide on the Q&A done during production as we talk
> >>>> about on Monday
> >>>> // slide 11
> >>>> Test to be performed –
> >>>> Amount on time –
> >>>> Tracking of outcome (how recorded)
> >>>> Check of temperature of APV chips with infrared sensor/camera. With
> >>>> cooled water
> >>>> Maybe done at UIC or at BNL -TDB
> >>>> Mentioned that this will be repeated when they arrive/assembled in
> >>>> at
> >>>> BNL
> >>>> Need a slide that details just in words the step for assembly
> >>>> You can keep the summary,
> >>>> But on slide before take the assembly tasks – put into a 3 column
> >>>> table
> >>>> with col 2 == time
> >>>> (days () , -- also is there no steps for curing time and column 3
> >>>> with
> >>>> institution/man power
> >>>> Repeat the number of assemblies to make; what can be done in
> >>>> parallel
> >>>> This is important information to evaluate the 3 months
> >>>> --
> >>>> Add an ESH slide describing the additional materials used in
> >>>> assembly
> >>>> (like glue, epoxy for encapsulation)
> >>>> Add statement that you follow UIC guidelines for working safely in
> >>>> the
> >>>> lab.
> >>>> Hybrid & T-boards
> >>>> Slide 5 ; reformulate the waiting for .. as we discussed.
> >>>> I assume we agreed we would not change mechanics for the T-board,
> >>>> but
> >>>> move the capacitor on the board. Add a week for that task, (design +
> >>>> signoff by group)
> >>>> You got my estimate for connectors-
> >>>> I suggest the make production slide into two
> >>>> One for hybrid and one for T-board – you might indicator vendor
> >>>> –
> >>>> Based on experience with prototype.
> >>>> Give the quantities being made
> >>>> One slide with ES&H
> >>>> Materials proper (is there a standard that is being followed
> >>>> --- non flammable PCB ?
> >>>> Work at lab at SDU minimal. Follows University work rules.
> >>>> Integration
> >>>> Rahul
> >>>> Please add a slide on ES&H
> >>>> That we follow BNL rules
> >>>> There will be safety review (before actual production?)
> >>>> Certainly, one before installation
> >>>> Any specific concern that you pay attention to on this
> >>>> Also if you can add a slide where you discuss your response to
> >>>> Charge
> >>>> questions?
> >>>> (Those relevant  like installation schedule)
> >>>> --
> >>>> Flemming Videbaek
> >>>> senior scientist
> >>>> videbaek @ bnl.gov [1]
> >>>> Brookhaven National Lab
> >>>> Physics Department
> >>>> Bldg 510D
> >>>> Upton, NY 11973
> >>>> phone: 631-344-4106
> >>>> cell     :
> >>>> 631-681-1596_______________________________________________
> >>>> Star-fst-l mailing list
> >>>> Star-fst-l AT lists.bnl.gov
> >>>> https://lists.bnl.gov/mailman/listinfo/star-fst-l
> >>> Links:
> >>> ------
> >>> [1] http://bnl.gov
> >> 
> >> --
> >> Flemming Videbaek
> >> senior scientist
> >> videbaek @ bnl.gov
> >> Brookhaven National Lab
> >> Physics Department
> >> Bldg 510D
> >> Upton, NY 11973
> >> 
> >> phone: 631-344-4106
> >> cell     :  631-681-1596
> >> _______________________________________________
> >> Star-fst-l mailing list
> >> Star-fst-l AT lists.bnl.gov
> >> https://lists.bnl.gov/mailman/listinfo/star-fst-l
> 
> -- 
> Flemming Videbaek
> senior scientist
> videbaek @ bnl.gov
> Brookhaven National Lab
> Physics Department
> Bldg 510D
> Upton, NY 11973
> 
> phone: 631-344-4106
> cell     :  631-681-1596
> _______________________________________________
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