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[Yi Yang <yiyang AT ncku.edu.tw>]

Hi all,

We tried to mount the T-Board onto MS and it seems to be okay. 

But I think we should prepare some toolings for the installation. 

Please check some photos in the following link:

T-Board_mounting.pdf

Cheers,

Yi

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web: http://phys.ncku.edu.tw/~yiyang
+++++++++++++++++++++++++++++++++++++++++++++++++++

On Tue, Aug 11, 2020 at 1:25 AM Ye, Zhenyu <yezhenyu AT uic.edu> wrote:

Minutes:

1. Flemming showed a draft of committee recommendations. He will have a meeting with the committee this afternoon. Expect to have a final version soon.

2. Silicon sensors
-> Zhenyu: requested for a new quote from Hamamatsu. Partial delivery of Silicon sensors is not possible.

3. Use thermal camera with cooling applied to the other side of the mechanical structure to check if there is air trapped between hybrid and MS
-> Yi: trying it this week. Consider doing this in production

4. Update the T-board design
-> Jianing will update the design this week
1) Move the capacitor to the other side
2) Add two ground holes
3) Tolerance for mounting T-board on the MS, taking into account the constraint from connecting the outer hybrid
4) Check mounting T-board on the MS -> Yi will do it at NCKU

5. Split HV for inner and outer
-> Decided to split HV. Mike/Gerard will look into the changes to PPB and back-of-crate boards

6. Integration
-> Rahul: will do a tolerance analysis, taking into account the clearance/project requirements but also what can be achieved by the machine shop. Need to have a plan for survey and discuss with Survey group

7. Simulation
-> Gavin/Shenghui: slow simulator based on cosmic data is ready. Trying to run the tracking code on RCF.

8. Mechanical structure
->  Yi: Han-Sheng leaving the project next week for PhD in US. Test the new procedure with old hybrids. Will verify with the vendor about changes to the precision pin: lead and pin lengths

***** Action items *****
1) Design and fabricate light-tight box for the DAQ integration test at BNL - Rahul/Flemming
2) Design the cooling lines, and cable trays between disks and cooling manifold - Felix/Rahul
3) Finalize how to mount modules onto the half-rings, and half-rings onto support structure, and document the proposed changes to the mechanical structure - Rahul/Yi/Zhenyu
4) Survey procedure/requirements - Rahul

5) Prepare documents for prelim Safety review with C-AD - all
6) Get updated quote from Hamamatsu - Zhenyu
7) Design and fabricate module storage boxes for production at UIC - Xu/Andres
8) Duplicate the module assembly tooling at UIC - Xu/Zhenyu
9) Discuss with Fermilab about module assembly schedule - Zhenyu

10) Update the T-board design to avoid the conflict with Mechanical structure - Jianing/Maowu
11) Check how T-board mount onto MS - Yi

12) Look into splitting the inner and outer sensor HV bias - Mike/Gerard
13) Send the problematic prototype cable-T-board assembly to Mike for investigation - Zhenyu/Mike
14) Develop the QC procedure for Inner cable and T-board assembly - Mike/Maowu

15) Look into the overall large CMN noise, and the abnormal noise of few channels first appear in the readout - Gerard/Xu
16) Check the FST noise performance at high readout rate - Xu/Zhenyu
17) Sett up the laser test stand to characterize prototype module performance - Andres/Zhenyu
18) FST slow simulator with efficiency/resolution measured with prototypes and study tracking performance - Gavin/Shenghui

> On Aug 8, 2020, at 10:48 AM, Ye, Zhenyu <yezhenyu AT uic.edu> wrote:
>
> Dear all,
>
> We will have the Weekly FST meeting on Monday starting at 9am EST (BNL local time).
>
> Bluejeans Meeting URL https://bluejeans.com/101020434
> Meeting ID: 101 020 434
>
> https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting
>
> 0. follow-ups on review and action items
> 1. Integration                                                                      by Rahul Sharma, Felix Archampong
> 2. Hybrid and T-board                                               by Maowu Nie, Jianing Dong
> 3. Simulation Studies                                                    by Gavin Wilks, Shenghui Zhang, Daniel Brandenburg
> 4. Prototype Module Assembly and Test                       by Zhenyu Ye
> 5. Mechanical structure                                                 by Yi Yang
> _______________________________________________
> Star-fst-l mailing list
> Star-fst-l AT lists.bnl.gov
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