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Chronological Thread  
  • From: Yi Yang <yiyang AT ncku.edu.tw>
  • To: Gerard Visser <gvisser AT indiana.edu>
  • Cc: Star-fst L <star-fst-l AT lists.bnl.gov>
  • Subject: Re: [Star-fst-l] Weekly FST meeting, August 10 9am (BNL time)
  • Date: Wed, 12 Aug 2020 20:50:36 +0800

Hi Gerard,

Not a program at all, it is good that we are on the same page. :-) 

Cheers,
Yi




+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web: http://phys.ncku.edu.tw/~yiyang
+++++++++++++++++++++++++++++++++++++++++++++++++++


On Wed, Aug 12, 2020 at 2:07 AM Gerard Visser <gvisser AT indiana.edu> wrote:
hi Yi,
        I apologize I was confused on that first point, I didn't remember that there
were capacitors on both sides of the T-board, which is clear from a look at the
gerber files again. The plan for new version is then that all will be on the
side facing away from mechanical structure, OK. Sorry.

                Gerard


On 8/11/2020 8:16 AM, Gerard Visser wrote:
> hi Yi,
>      I am consfused by the pictures since don't the big tantalum capacitors on
> existing T-board face towards the mechanical structure? That was said to be the
> problem, which is now being fixed. But it doesn't look like a problem in your
> pictures???
>      Were you able to actually plug in the outer hybrid? It looks like you did.
>      Also as a small comment, will it really be good to use loose nuts for this
> fastening? We should as much as possible avoid the risk of dropping small parts,
> *especially* for an operation that might have to be performed with the FST in
> STAR out on the insertion rails, above and around the TPC and BEMC electronics
> boards which are all exposed there. I had though there would be press-nuts on
> one side or the other. Maybe this is impossible, at least now, but we should
> think about it.
>      Sincerely,
>
>          Gerard
>
>
> On 8/10/2020 11:33 PM, Yi Yang wrote:
>> Hi all,
>>
>> We tried to mount the T-Board onto MS and it seems to be okay.
>> But I think we should prepare some toolings for the installation.
>> Please check some photos in the following link:
>> T-Board_mounting.pdf
>> <https://drupal.star.bnl.gov/STAR/system/files/T-Board_mounting.pdf>
>>
>> Cheers,
>> Yi
>>
>>
>> +++++++++++++++++++++++++++++++++++++++++++++++++++
>> Yi Yang, Associate Professor
>> Department of Physics
>> National Cheng Kung University
>> Tainan, 701 Taiwan
>> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>> Tel: +886-6-2757575 ext.65237
>> Fax: +886-6-2747995
>> Group Web: https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!SAQPx9Ri_U0LMsI-kJryuTi7kmQ5x9z2cuwXyVQr_mwgVrxl6XH6qVUc5nh1_agdRO6tNDw$ 
>> <https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!RrBFMBGZeyx7A9EvAOYEtwDPoTzu6UesNtbcWnWCrk3Ntska06asz6ZScNS3e41dLZMtdaQ$>
>>
>> +++++++++++++++++++++++++++++++++++++++++++++++++++
>>
>>
>> On Tue, Aug 11, 2020 at 1:25 AM Ye, Zhenyu <yezhenyu AT uic.edu
>> <mailto:yezhenyu AT uic.edu>> wrote:
>>
>>     Minutes:
>>
>>     1. Flemming showed a draft of committee recommendations. He will have a
>>     meeting with the committee this afternoon. Expect to have a final version
>> soon.
>>
>>     2. Silicon sensors
>>     -> Zhenyu: requested for a new quote from Hamamatsu. Partial delivery of
>>     Silicon sensors is not possible.
>>
>>     3. Use thermal camera with cooling applied to the other side of the
>>     mechanical structure to check if there is air trapped between hybrid and MS
>>     -> Yi: trying it this week. Consider doing this in production
>>
>>     4. Update the T-board design
>>     -> Jianing will update the design this week
>>     1) Move the capacitor to the other side
>>     2) Add two ground holes
>>     3) Tolerance for mounting T-board on the MS, taking into account the
>>     constraint from connecting the outer hybrid
>>     4) Check mounting T-board on the MS -> Yi will do it at NCKU
>>
>>     5. Split HV for inner and outer
>>     -> Decided to split HV. Mike/Gerard will look into the changes to PPB and
>>     back-of-crate boards
>>
>>     6. Integration
>>     -> Rahul: will do a tolerance analysis, taking into account the
>>     clearance/project requirements but also what can be achieved by the machine
>>     shop. Need to have a plan for survey and discuss with Survey group
>>
>>     7. Simulation
>>     -> Gavin/Shenghui: slow simulator based on cosmic data is ready. Trying to
>>     run the tracking code on RCF.
>>
>>     8. Mechanical structure
>>     ->  Yi: Han-Sheng leaving the project next week for PhD in US. Test the new
>>     procedure with old hybrids. Will verify with the vendor about changes to the
>>     precision pin: lead and pin lengths
>>
>>     ***** Action items *****
>>     1) Design and fabricate light-tight box for the DAQ integration test at BNL
>>     - Rahul/Flemming
>>     2) Design the cooling lines, and cable trays between disks and cooling
>>     manifold - Felix/Rahul
>>     3) Finalize how to mount modules onto the half-rings, and half-rings onto
>>     support structure, and document the proposed changes to the mechanical
>>     structure - Rahul/Yi/Zhenyu
>>     4) Survey procedure/requirements - Rahul
>>
>>     5) Prepare documents for prelim Safety review with C-AD - all
>>     6) Get updated quote from Hamamatsu - Zhenyu
>>     7) Design and fabricate module storage boxes for production at UIC -
>> Xu/Andres
>>     8) Duplicate the module assembly tooling at UIC - Xu/Zhenyu
>>     9) Discuss with Fermilab about module assembly schedule - Zhenyu
>>
>>     10) Update the T-board design to avoid the conflict with Mechanical
>>     structure - Jianing/Maowu
>>     11) Check how T-board mount onto MS - Yi
>>
>>     12) Look into splitting the inner and outer sensor HV bias - Mike/Gerard
>>     13) Send the problematic prototype cable-T-board assembly to Mike for
>>     investigation - Zhenyu/Mike
>>     14) Develop the QC procedure for Inner cable and T-board assembly -
>> Mike/Maowu
>>
>>     15) Look into the overall large CMN noise, and the abnormal noise of few
>>     channels first appear in the readout - Gerard/Xu
>>     16) Check the FST noise performance at high readout rate - Xu/Zhenyu
>>     17) Sett up the laser test stand to characterize prototype module
>>     performance - Andres/Zhenyu
>>     18) FST slow simulator with efficiency/resolution measured with prototypes
>>     and study tracking performance - Gavin/Shenghui
>>
>>      > On Aug 8, 2020, at 10:48 AM, Ye, Zhenyu <yezhenyu AT uic.edu
>>     <mailto:yezhenyu AT uic.edu>> wrote:
>>      >
>>      > Dear all,
>>      >
>>      > We will have the Weekly FST meeting on Monday starting at 9am EST (BNL
>>     local time).
>>      >
>>      > Bluejeans Meeting URL https://bluejeans.com/101020434
>>      > Meeting ID: 101 020 434
>>      >
>>      >
>>     
>> https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting
>>
>>      >
>>      > 0. follow-ups on review and action items
>>      > 1. Integration                by Rahul Sharma, Felix Archampong
>>      > 2. Hybrid and T-board                                               by
>>     Maowu Nie, Jianing Dong
>>      > 3. Simulation Studies     by Gavin Wilks, Shenghui Zhang, Daniel
>> Brandenburg
>>      > 4. Prototype Module Assembly and Test                       by Zhenyu Ye
>>      > 5. Mechanical structure       by Yi Yang
>>      > _______________________________________________
>>      > Star-fst-l mailing list
>>      > Star-fst-l AT lists.bnl.gov <mailto:Star-fst-l AT lists.bnl.gov>
>>      > https://lists.bnl.gov/mailman/listinfo/star-fst-l
>>
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