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  • From: Gerard Visser <gvisser AT indiana.edu>
  • To: videbaek <videbaek AT bnl.gov>, Yi Yang <yiyang AT ncku.edu.tw>
  • Cc: Star-fst L <star-fst-l AT lists.bnl.gov>
  • Subject: Re: [Star-fst-l] Weekly FST meeting, August 10 9am (BNL time)
  • Date: Wed, 12 Aug 2020 13:20:50 -0400

Hi Flemming,
I think that that is certainly the right plan. But if later there is a problem developed and found just before (or after) insertion, I suppose we might want to try to fix it in situ rather than dismounting and taking back to the clean roon?
If the decision is that for any repair we remove the half to the clean room, then we don't have to worry about the risk to TPC/BEMC electronics in case any small part is dropped. I think we can work on it carefully in place if need be though, we did so for FGT. But we should try to avoid very small loose parts -- and anyway as Yi said they also pose a risk for the FST itself.

Gerard


On 8/12/2020 1:15 PM, videbaek wrote:
I would hope that all the cable mounting and dressing would be done on the half-structures in the clean room so the setup could be checked out there as the modules arrive. But in any case you want to make it as simple and safe as possible.

best F.


On 2020-08-12 08:59, Yi Yang wrote:
Hi Gerard,

Ahh... sorry, I forgot to reply this point.

Actually I don't think we will use those loose nuts for the final
assembly.
I totally agree with you that it is extremely dangerous to use them. I
dropped them on the chip and sensor areas many times while mounting
the T-board on.

We didn't decide how to mount them yet, so any suggestions are very
welcome.

Cheers,
Yi

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web:
https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!VAiPy1lSYNWxsoS_nLbQ9qCAiTsWdUyIUD-IXVA3-XPawTyUMi3wK2JvQp5lX7K4Nvt-UKQ$
[1]
+++++++++++++++++++++++++++++++++++++++++++++++++++

On Wed, Aug 12, 2020 at 8:55 PM Gerard Visser <gvisser AT indiana.edu>
wrote:

hi Yi,
Please think about if there is any reasonable alternative to
using those small
loose nuts. Dropping them inside the magnet would be a risk for
STAR.
Thanks,

Gerard

On 8/12/2020 8:50 AM, Yi Yang wrote:
Hi Gerard,

Not a program at all, it is good that we are on the same page. :-)

Cheers,
Yi




+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web:
https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!VAiPy1lSYNWxsoS_nLbQ9qCAiTsWdUyIUD-IXVA3-XPawTyUMi3wK2JvQp5lX7K4Nvt-UKQ$
[1]
+++++++++++++++++++++++++++++++++++++++++++++++++++


On Wed, Aug 12, 2020 at 2:07 AM Gerard Visser <gvisser AT indiana.edu

<mailto:gvisser AT indiana.edu>> wrote:

hi Yi,
I apologize I was confused on that first point, I
didn't remember
that there
were capacitors on both sides of the T-board, which is clear
from a look at the
gerber files again. The plan for new version is then that all
will be on the
side facing away from mechanical structure, OK. Sorry.

Gerard


On 8/11/2020 8:16 AM, Gerard Visser wrote:
hi Yi,
     I am consfused by the pictures since don't the big
tantalum
capacitors on
existing T-board face towards the mechanical structure?
That was said to
be the
problem, which is now being fixed. But it doesn't look like
a problem in
your
pictures???
     Were you able to actually plug in the outer hybrid? It
looks like
you did.
     Also as a small comment, will it really be good to use
loose nuts
for this
fastening? We should as much as possible avoid the risk of
dropping small
parts,
*especially* for an operation that might have to be
performed with the
FST in
STAR out on the insertion rails, above and around the TPC
and BEMC
electronics
boards which are all exposed there. I had though there
would be
press-nuts on
one side or the other. Maybe this is impossible, at least
now, but we should
think about it.
     Sincerely,

         Gerard


On 8/10/2020 11:33 PM, Yi Yang wrote:
Hi all,

We tried to mount the T-Board onto MS and it seems to be
okay.
But I think we should prepare some toolings for the
installation.
Please check some photos in the following link:
T-Board_mounting.pdf

<https://drupal.star.bnl.gov/STAR/system/files/T-Board_mounting.pdf>

Cheers,
Yi


+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
<mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>>
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web:


https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!SAQPx9Ri_U0LMsI-kJryuTi7kmQ5x9z2cuwXyVQr_mwgVrxl6XH6qVUc5nh1_agdRO6tNDw$




<https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!RrBFMBGZeyx7A9EvAOYEtwDPoTzu6UesNtbcWnWCrk3Ntska06asz6ZScNS3e41dLZMtdaQ$>


+++++++++++++++++++++++++++++++++++++++++++++++++++


On Tue, Aug 11, 2020 at 1:25 AM Ye, Zhenyu
<yezhenyu AT uic.edu
<mailto:yezhenyu AT uic.edu>
<mailto:yezhenyu AT uic.edu <mailto:yezhenyu AT uic.edu>>>
wrote:

    Minutes:

    1. Flemming showed a draft of committee
recommendations. He will have a
    meeting with the committee this afternoon. Expect to
have a final
version
soon.

    2. Silicon sensors
    -> Zhenyu: requested for a new quote from Hamamatsu.
Partial delivery of
    Silicon sensors is not possible.

    3. Use thermal camera with cooling applied to the
other side of the
    mechanical structure to check if there is air trapped
between hybrid
and MS
    -> Yi: trying it this week. Consider doing this in
production

    4. Update the T-board design
    -> Jianing will update the design this week
    1) Move the capacitor to the other side
    2) Add two ground holes
    3) Tolerance for mounting T-board on the MS, taking
into account the
    constraint from connecting the outer hybrid
    4) Check mounting T-board on the MS -> Yi will do it
at NCKU

    5. Split HV for inner and outer
    -> Decided to split HV. Mike/Gerard will look into the
changes to
PPB and
    back-of-crate boards

    6. Integration
    -> Rahul: will do a tolerance analysis, taking into
account the
    clearance/project requirements but also what can be
achieved by the
machine
    shop. Need to have a plan for survey and discuss with
Survey group

    7. Simulation
    -> Gavin/Shenghui: slow simulator based on cosmic data
is ready.
Trying to
    run the tracking code on RCF.

    8. Mechanical structure
    ->  Yi: Han-Sheng leaving the project next week for
PhD in US. Test
the new
    procedure with old hybrids. Will verify with the
vendor about
changes to the
    precision pin: lead and pin lengths

    ***** Action items *****
    1) Design and fabricate light-tight box for the DAQ
integration test
at BNL
    - Rahul/Flemming
    2) Design the cooling lines, and cable trays between
disks and cooling
    manifold - Felix/Rahul
    3) Finalize how to mount modules onto the half-rings,
and half-rings
onto
    support structure, and document the proposed changes
to the mechanical
    structure - Rahul/Yi/Zhenyu
    4) Survey procedure/requirements - Rahul

    5) Prepare documents for prelim Safety review with
C-AD - all
    6) Get updated quote from Hamamatsu - Zhenyu
    7) Design and fabricate module storage boxes for
production at UIC -
Xu/Andres
    8) Duplicate the module assembly tooling at UIC -
Xu/Zhenyu
    9) Discuss with Fermilab about module assembly
schedule - Zhenyu

    10) Update the T-board design to avoid the conflict
with Mechanical
    structure - Jianing/Maowu
    11) Check how T-board mount onto MS - Yi

    12) Look into splitting the inner and outer sensor HV
bias - Mike/Gerard
    13) Send the problematic prototype cable-T-board
assembly to Mike for
    investigation - Zhenyu/Mike
    14) Develop the QC procedure for Inner cable and
T-board assembly -
Mike/Maowu

    15) Look into the overall large CMN noise, and the
abnormal noise of few
    channels first appear in the readout - Gerard/Xu
    16) Check the FST noise performance at high readout
rate - Xu/Zhenyu
    17) Sett up the laser test stand to characterize
prototype module
    performance - Andres/Zhenyu
    18) FST slow simulator with efficiency/resolution
measured with
prototypes
    and study tracking performance - Gavin/Shenghui

     > On Aug 8, 2020, at 10:48 AM, Ye, Zhenyu
<yezhenyu AT uic.edu
<mailto:yezhenyu AT uic.edu>
    <mailto:yezhenyu AT uic.edu <mailto:yezhenyu AT uic.edu>>>
wrote:
     >
     > Dear all,
     >
     > We will have the Weekly FST meeting on Monday
starting at 9am EST
(BNL
    local time).
     >
     > Bluejeans Meeting URL
https://bluejeans.com/101020434
     > Meeting ID: 101 020 434
     >
     >




https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting


     >
     > 0. follow-ups on review and action items
     > 1. Integration                by Rahul Sharma,
Felix Archampong
     > 2. Hybrid and T-board

by
    Maowu Nie, Jianing Dong
     > 3. Simulation Studies     by Gavin Wilks, Shenghui
Zhang, Daniel
Brandenburg
     > 4. Prototype Module Assembly and Test
by
Zhenyu Ye
     > 5. Mechanical structure       by Yi Yang
     > _______________________________________________
     > Star-fst-l mailing list
     > Star-fst-l AT lists.bnl.gov
<mailto:Star-fst-l AT lists.bnl.gov>
<mailto:Star-fst-l AT lists.bnl.gov
<mailto:Star-fst-l AT lists.bnl.gov>>
     > https://lists.bnl.gov/mailman/listinfo/star-fst-l

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