Star-fst-l mailing list

[Yi Yang <yiyang AT ncku.edu.tw>]

Hi Gerard,

Ahh... sorry, I forgot to reply this point.

Actually I don't think we will use those loose nuts for the final assembly. 

I totally agree with you that it is extremely dangerous to use them. I dropped them on the chip and sensor areas many times while mounting the T-board on. 

We didn't decide how to mount them yet, so any suggestions are very welcome. 

Cheers,

Yi

+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Associate Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web: http://phys.ncku.edu.tw/~yiyang
+++++++++++++++++++++++++++++++++++++++++++++++++++

On Wed, Aug 12, 2020 at 8:55 PM Gerard Visser <gvisser AT indiana.edu> wrote:

hi Yi,
        Please think about if there is any reasonable alternative to using those small
loose nuts. Dropping them inside the magnet would be a risk for STAR.
        Thanks,

                Gerard


On 8/12/2020 8:50 AM, Yi Yang wrote:
> Hi Gerard,
>
> Not a program at all, it is good that we are on the same page. :-)
>
> Cheers,
> Yi
>
>
>
>
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> Yi Yang, Associate Professor
> Department of Physics
> National Cheng Kung University
> Tainan, 701 Taiwan
> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
> Tel: +886-6-2757575 ext.65237
> Fax: +886-6-2747995
> Group Web: http://phys.ncku.edu.tw/~yiyang
> +++++++++++++++++++++++++++++++++++++++++++++++++++
>
>
> On Wed, Aug 12, 2020 at 2:07 AM Gerard Visser <gvisser AT indiana.edu
> <mailto:gvisser AT indiana.edu>> wrote:
>
>     hi Yi,
>              I apologize I was confused on that first point, I didn't remember
>     that there
>     were capacitors on both sides of the T-board, which is clear from a look at the
>     gerber files again. The plan for new version is then that all will be on the
>     side facing away from mechanical structure, OK. Sorry.
>
>                      Gerard
>
>
>     On 8/11/2020 8:16 AM, Gerard Visser wrote:
>      > hi Yi,
>      >      I am consfused by the pictures since don't the big tantalum
>     capacitors on
>      > existing T-board face towards the mechanical structure? That was said to
>     be the
>      > problem, which is now being fixed. But it doesn't look like a problem in
>     your
>      > pictures???
>      >      Were you able to actually plug in the outer hybrid? It looks like
>     you did.
>      >      Also as a small comment, will it really be good to use loose nuts
>     for this
>      > fastening? We should as much as possible avoid the risk of dropping small
>     parts,
>      > *especially* for an operation that might have to be performed with the
>     FST in
>      > STAR out on the insertion rails, above and around the TPC and BEMC
>     electronics
>      > boards which are all exposed there. I had though there would be
>     press-nuts on
>      > one side or the other. Maybe this is impossible, at least now, but we should
>      > think about it.
>      >      Sincerely,
>      >
>      >          Gerard
>      >
>      >
>      > On 8/10/2020 11:33 PM, Yi Yang wrote:
>      >> Hi all,
>      >>
>      >> We tried to mount the T-Board onto MS and it seems to be okay.
>      >> But I think we should prepare some toolings for the installation.
>      >> Please check some photos in the following link:
>      >> T-Board_mounting.pdf
>      >> <https://drupal.star.bnl.gov/STAR/system/files/T-Board_mounting.pdf>
>      >>
>      >> Cheers,
>      >> Yi
>      >>
>      >>
>      >> +++++++++++++++++++++++++++++++++++++++++++++++++++
>      >> Yi Yang, Associate Professor
>      >> Department of Physics
>      >> National Cheng Kung University
>      >> Tainan, 701 Taiwan
>      >> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>     <mailto:yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>>
>      >> Tel: +886-6-2757575 ext.65237
>      >> Fax: +886-6-2747995
>      >> Group Web:
>     https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!SAQPx9Ri_U0LMsI-kJryuTi7kmQ5x9z2cuwXyVQr_mwgVrxl6XH6qVUc5nh1_agdRO6tNDw$
>
>      >>
>     <https://urldefense.com/v3/__http://phys.ncku.edu.tw/*yiyang__;fg!!P4SdNyxKAPE!RrBFMBGZeyx7A9EvAOYEtwDPoTzu6UesNtbcWnWCrk3Ntska06asz6ZScNS3e41dLZMtdaQ$>
>
>      >>
>      >> +++++++++++++++++++++++++++++++++++++++++++++++++++
>      >>
>      >>
>      >> On Tue, Aug 11, 2020 at 1:25 AM Ye, Zhenyu <yezhenyu AT uic.edu
>     <mailto:yezhenyu AT uic.edu>
>      >> <mailto:yezhenyu AT uic.edu <mailto:yezhenyu AT uic.edu>>> wrote:
>      >>
>      >>     Minutes:
>      >>
>      >>     1. Flemming showed a draft of committee recommendations. He will have a
>      >>     meeting with the committee this afternoon. Expect to have a final
>     version
>      >> soon.
>      >>
>      >>     2. Silicon sensors
>      >>     -> Zhenyu: requested for a new quote from Hamamatsu. Partial delivery of
>      >>     Silicon sensors is not possible.
>      >>
>      >>     3. Use thermal camera with cooling applied to the other side of the
>      >>     mechanical structure to check if there is air trapped between hybrid
>     and MS
>      >>     -> Yi: trying it this week. Consider doing this in production
>      >>
>      >>     4. Update the T-board design
>      >>     -> Jianing will update the design this week
>      >>     1) Move the capacitor to the other side
>      >>     2) Add two ground holes
>      >>     3) Tolerance for mounting T-board on the MS, taking into account the
>      >>     constraint from connecting the outer hybrid
>      >>     4) Check mounting T-board on the MS -> Yi will do it at NCKU
>      >>
>      >>     5. Split HV for inner and outer
>      >>     -> Decided to split HV. Mike/Gerard will look into the changes to
>     PPB and
>      >>     back-of-crate boards
>      >>
>      >>     6. Integration
>      >>     -> Rahul: will do a tolerance analysis, taking into account the
>      >>     clearance/project requirements but also what can be achieved by the
>     machine
>      >>     shop. Need to have a plan for survey and discuss with Survey group
>      >>
>      >>     7. Simulation
>      >>     -> Gavin/Shenghui: slow simulator based on cosmic data is ready.
>     Trying to
>      >>     run the tracking code on RCF.
>      >>
>      >>     8. Mechanical structure
>      >>     ->  Yi: Han-Sheng leaving the project next week for PhD in US. Test
>     the new
>      >>     procedure with old hybrids. Will verify with the vendor about
>     changes to the
>      >>     precision pin: lead and pin lengths
>      >>
>      >>     ***** Action items *****
>      >>     1) Design and fabricate light-tight box for the DAQ integration test
>     at BNL
>      >>     - Rahul/Flemming
>      >>     2) Design the cooling lines, and cable trays between disks and cooling
>      >>     manifold - Felix/Rahul
>      >>     3) Finalize how to mount modules onto the half-rings, and half-rings
>     onto
>      >>     support structure, and document the proposed changes to the mechanical
>      >>     structure - Rahul/Yi/Zhenyu
>      >>     4) Survey procedure/requirements - Rahul
>      >>
>      >>     5) Prepare documents for prelim Safety review with C-AD - all
>      >>     6) Get updated quote from Hamamatsu - Zhenyu
>      >>     7) Design and fabricate module storage boxes for production at UIC -
>      >> Xu/Andres
>      >>     8) Duplicate the module assembly tooling at UIC - Xu/Zhenyu
>      >>     9) Discuss with Fermilab about module assembly schedule - Zhenyu
>      >>
>      >>     10) Update the T-board design to avoid the conflict with Mechanical
>      >>     structure - Jianing/Maowu
>      >>     11) Check how T-board mount onto MS - Yi
>      >>
>      >>     12) Look into splitting the inner and outer sensor HV bias - Mike/Gerard
>      >>     13) Send the problematic prototype cable-T-board assembly to Mike for
>      >>     investigation - Zhenyu/Mike
>      >>     14) Develop the QC procedure for Inner cable and T-board assembly -
>      >> Mike/Maowu
>      >>
>      >>     15) Look into the overall large CMN noise, and the abnormal noise of few
>      >>     channels first appear in the readout - Gerard/Xu
>      >>     16) Check the FST noise performance at high readout rate - Xu/Zhenyu
>      >>     17) Sett up the laser test stand to characterize prototype module
>      >>     performance - Andres/Zhenyu
>      >>     18) FST slow simulator with efficiency/resolution measured with
>     prototypes
>      >>     and study tracking performance - Gavin/Shenghui
>      >>
>      >>      > On Aug 8, 2020, at 10:48 AM, Ye, Zhenyu <yezhenyu AT uic.edu
>     <mailto:yezhenyu AT uic.edu>
>      >>     <mailto:yezhenyu AT uic.edu <mailto:yezhenyu AT uic.edu>>> wrote:
>      >>      >
>      >>      > Dear all,
>      >>      >
>      >>      > We will have the Weekly FST meeting on Monday starting at 9am EST
>     (BNL
>      >>     local time).
>      >>      >
>      >>      > Bluejeans Meeting URL https://bluejeans.com/101020434
>      >>      > Meeting ID: 101 020 434
>      >>      >
>      >>      >
>      >>
>      >>
>     https://drupal.star.bnl.gov/STAR/event/2020/08/10/star-forward-silicon-tracker-meeting
>
>      >>
>      >>      >
>      >>      > 0. follow-ups on review and action items
>      >>      > 1. Integration                by Rahul Sharma, Felix Archampong
>      >>      > 2. Hybrid and T-board                                           
>         by
>      >>     Maowu Nie, Jianing Dong
>      >>      > 3. Simulation Studies     by Gavin Wilks, Shenghui Zhang, Daniel
>      >> Brandenburg
>      >>      > 4. Prototype Module Assembly and Test                       by
>     Zhenyu Ye
>      >>      > 5. Mechanical structure       by Yi Yang
>      >>      > _______________________________________________
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>      >>
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