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[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Hi Gerard,

Li and I were talking about hybrids for initial testing with APV chips so 
that I can hook up the test cables and DAQ system, where the glueing will 
need to be done by pressing the hybrid against the PCB with some weights. 

Mounting hybrids to the mechanical structures for the prototype and 
production modules will be done by AIDC. The procedure for the prototype and 
production modules are not defined yet. Yi agreed to get the proposed 
procedure from them but I have not seen it so far. 

Zhenyu

> On May 20, 2019, at 9:50 AM, Gerard Visser <gvisser AT indiana.edu> wrote:
> 
> hi Zhenyu, Li,
>       Just to check here: In order to wirebond the APV to hybrid it's 
> certainly necessary to have a solid support under the bod pads. So 
> "glueing" has to be done in a vacuum bag or press or something, I think. Is 
> the procedure for this gluing defined? I believe that the IST hybrid to 
> stave was done in a vacuum bag, although I really don't know. You might ask 
> Eric Anderson.
> 
>       Gerard
> 
> 
> On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
>> Hi Li,
>> Please glue the hybrid to a bare PCB board, mount devices (R, C, 
>> connectors) onto the hybrid, and then send it to me. Do you have a rough 
>> time estimate when this can be done?
>> Thanks,
>> Zhenyu
>>> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn> wrote:
>>> 
>>> Hi Zhenyu,
>>> 
>>> As it was discussed, the whole system shall be tested electronically 
>>> first. We will attach devices to hybrids and send it to you. Shall hybrid 
>>> be glued on a *toy* supporting structure before sending to you so that 
>>> APVs will be attached later? Or sending the hybrid with devices attached 
>>> but not glued to supporters?
>>> 
>>> Thanks,
>>> Li
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