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[Gerard Visser <gvisser AT indiana.edu>]

hi Zhenyu, Li,
	Just to check here: In order to wirebond the APV to hybrid it's certainly 
necessary to have a solid support under the bod pads. So "glueing" has to be 
done in a vacuum bag or press or something, I think. Is the procedure for this 
gluing defined? I believe that the IST hybrid to stave was done in a vacuum bag, 
although I really don't know. You might ask Eric Anderson.

        Gerard


On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
> Hi Li,
>
> Please glue the hybrid to a bare PCB board, mount devices (R, C, connectors) 
> onto the hybrid, and then send it to me. Do you have a rough time estimate 
> when this can be done?
>
> Thanks,
> Zhenyu
>
> > On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn> wrote:
> >
> > Hi Zhenyu,
> >
> > As it was discussed, the whole system shall be tested electronically first. 
> > We will attach devices to hybrids and send it to you. Shall hybrid be glued 
> > on a *toy* supporting structure before sending to you so that APVs will be 
> > attached later? Or sending the hybrid with devices attached but not glued to 
> > supporters?
> >
> > Thanks,
> > Li
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