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[Zhenyu Ye <yezhenyu2003 AT gmail.com>]

Hi Gerard, all,

Let me summarize the status and plan of the module assembly and tests:

There will be two versions of hybrids, and two versions of mechanical 
structures (hopefully) by the end of June.

Version A: these are the ones we saw the BNL f2f meeting. Hybrids looked fine 
and passed the vendor’s tests. The first batch of MS looked bended at the 
corners. The second batch are expected on May 27. We don’t know how they will 
look like.

Version B: still being worked on by NCKU and SDU. The design will be close to 
version A but with modified dimensions so that they match with each other and 
with the silicon sensors. These could take another 1.5 months. 

For the prototype modules, they will be made from version B of hybrids and 
MS, but they won’t be ready before the end of June, as explained above. In 
order to have a quick test of hybrids and test cables and training of the 
student with wire-bonder at UIC, we will start with version A of the hybrids 
attached on bare PCB, which is what Li and I discussed at the SDU workshop 
about 1.5 weeks ago and why Li sent the first email early today. I guess 
there is always a small possibility that things may not work well, but let’s 
see. 

Best,
Zhenyu


> On May 20, 2019, at 7:17 PM, Gerard Visser <gvisser AT indiana.edu> wrote:
> 
> hi Yi,
>       Thanks that sounds good. Is it impractical to do this for the first 
> test too? I would think that, A. it is good to prototype that work in 
> itself, and B. if this is skipped for the first test prototype the wire 
> bonding might not work well, and if the hybrid seems not to work reliably 
> we won't know if this might be the reason or if there might be a real 
> problem. Of course if it does work well then it will have been fine to skip 
> the more complicated procedure, I grant that.
>       Sincerely,
> 
>               Gerard
> 
> 
> p.s. On a somewhat related note, for the first test prototype is there any 
> heat conduction from APV chip into the carrier board or something like 
> that? In the same sort of way if it works without, fine, but if it does not 
> we don't know if there is a real problem or only a trivial issue. The APV 
> chip is somewhat temperature-sensitive I believe.
> 
> 
> On 5/20/2019 8:04 PM, Yi Yang wrote:
>> Hi Gerard,
>> Yes, you are right. For the real one, it will be done in a vacuum bad with 
>> pressure.
>> The gluing procedure is well established in AIDC and we will provide it 
>> soon.
>> Cheers,
>> Yi
>> +++++++++++++++++++++++++++++++++++++++++++++++++++
>> Yi Yang, Assistant Professor
>> Department of Physics
>> National Cheng Kung University
>> Tainan, 701 Taiwan
>> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
>> Tel: +886-6-2757575 ext.65237
>> Fax: +886-6-2747995
>> Group Web: 
>> https://urldefense.proofpoint.com/v2/url?u=http-3A__phys.ncku.edu.tw_-7Eyiyang&d=DwIDaQ&c=aTOVZmpUfPKZuaG9NO7J7Mh6imZbfhL47t9CpZ-pCOw&r=8ygAAI6gQzVe9hFCRdEAO5MwBJh2ID34fiwLpV3P1Xo&m=qJJlFMYZKdtBJJFLQZgiT0orfK52Q9WNFw5pB_aZvSk&s=Zy0OiGZEHrnLQn5ZL4xBSPWL8oo3DOprQsIZp511xKw&e=
>>  +++++++++++++++++++++++++++++++++++++++++++++++++++
>> On Mon, May 20, 2019 at 10:50 PM Gerard Visser <gvisser AT indiana.edu 
>> <mailto:gvisser AT indiana.edu>> wrote:
>>    hi Zhenyu, Li,
>>             Just to check here: In order to wirebond the APV to hybrid it's
>>    certainly
>>    necessary to have a solid support under the bod pads. So "glueing" has 
>> to be
>>    done in a vacuum bag or press or something, I think. Is the procedure 
>> for this
>>    gluing defined? I believe that the IST hybrid to stave was done in a 
>> vacuum
>>    bag,
>>    although I really don't know. You might ask Eric Anderson.
>>             Gerard
>>    On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
>>     > Hi Li,
>>     >
>>     > Please glue the hybrid to a bare PCB board, mount devices (R, C,
>>    connectors) onto the hybrid, and then send it to me. Do you have a rough
>>    time estimate when this can be done?
>>     >
>>     > Thanks,
>>     > Zhenyu
>>     >
>>     >> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn
>>    <mailto:li.yi AT sdu.edu.cn>> wrote:
>>     >>
>>     >> Hi Zhenyu,
>>     >>
>>     >> As it was discussed, the whole system shall be tested electronically
>>    first. We will attach devices to hybrids and send it to you. Shall 
>> hybrid be
>>    glued on a *toy* supporting structure before sending to you so that APVs
>>    will be attached later? Or sending the hybrid with devices attached but 
>> not
>>    glued to supporters?
>>     >>
>>     >> Thanks,
>>     >> Li
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