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[LI YI <li.yi AT sdu.edu.cn>]

Hi Gerard,

Thanks for the feedback! Yes, 2b) will be used.

We have confirmed with vendor that ENEPIG was used.

Best,
Li

On Tue, May 21, 2019 at 8:00 PM Gerard Visser <gvisser AT indiana.edu> wrote:
>
> hi Li,
>         I don't see much advantage to 2a) vs. 2b), if the mechanical 
> details of these
> first hybrids differ from the real ones anyway. Plan 2b) sounds better if 
> the
> main goal is test wire-bonding and to to exercise the hybrids and T-board 
> etc.
> electrically and read out some APV data.
>
>         Gerard
>
> p.s. By the way, what is the finish on the wire-bond pads on the hybrid? Is 
> it
> ENEPIG? (As far as I recall that is what was done on the IST hybrids.)
>
>
> On 5/21/2019 2:08 AM, LI YI wrote:
> > Thanks everyone for the comments!
> >
> > Zhenyu, so we will aim to deliver the one with all devices mounted and
> > glued to a hard PCB.
> >
> > Two questions:
> > 1. Is there minimal requirement/procedure for current gluing and what
> > kind of glue shall be used?
> > 2. Plan for hard PCB:
> >      a. one PCB with inner and outer glued on two sides just like the
> > design. We need to work with the company for the position for T-board
> > connection. Inner and outer need to carefully align with each other so
> > that we can connect them to T-board.
> >      b. Two PCB with inner and outer glued on each board. It may give
> > more flexibility for adjusting alignment ourself for the three parts
> > (inner, outer, T-board).
> >
> > Here is a break-down for current time estimations:
> >
> > 1. at least 3 weeks for ordering R, C.
> > We probably will use the connector pairs Yang Yi sent us. The mainland
> > agent replied us that this type of connector is pretty new to them and
> > is not in stock. They need to contact their main company in France
> > which is still in holiday. So they don't have estimation for
> > connectors. The connector pairs we had from Yi have been connected and
> > disconnected many times by now and hopefully it still works.
> >
> > 2. ~3 weeks for mounting devices. We will contact company to mount the 
> > devices.
> >
> > Best,
> > Li
> >
> >
> > On Tue, May 21, 2019 at 9:39 AM Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
> >>
> >> Hi Gerard, all,
> >>
> >> Let me summarize the status and plan of the module assembly and tests:
> >>
> >> There will be two versions of hybrids, and two versions of mechanical 
> >> structures (hopefully) by the end of June.
> >>
> >> Version A: these are the ones we saw the BNL f2f meeting. Hybrids looked 
> >> fine and passed the vendor’s tests. The first batch of MS looked bended 
> >> at the corners. The second batch are expected on May 27. We don’t know 
> >> how they will look like.
> >>
> >> Version B: still being worked on by NCKU and SDU. The design will be 
> >> close to version A but with modified dimensions so that they match with 
> >> each other and with the silicon sensors. These could take another 1.5 
> >> months.
> >>
> >> For the prototype modules, they will be made from version B of hybrids 
> >> and MS, but they won’t be ready before the end of June, as explained 
> >> above. In order to have a quick test of hybrids and test cables and 
> >> training of the student with wire-bonder at UIC, we will start with 
> >> version A of the hybrids attached on bare PCB, which is what Li and I 
> >> discussed at the SDU workshop about 1.5 weeks ago and why Li sent the 
> >> first email early today. I guess there is always a small possibility 
> >> that things may not work well, but let’s see.
> >>
> >> Best,
> >> Zhenyu
> >>
> >>
> >>> On May 20, 2019, at 7:17 PM, Gerard Visser <gvisser AT indiana.edu> wrote:
> >>>
> >>> hi Yi,
> >>>        Thanks that sounds good. Is it impractical to do this for the 
> >>> first test too? I would think that, A. it is good to prototype that 
> >>> work in itself, and B. if this is skipped for the first test prototype 
> >>> the wire bonding might not work well, and if the hybrid seems not to 
> >>> work reliably we won't know if this might be the reason or if there 
> >>> might be a real problem. Of course if it does work well then it will 
> >>> have been fine to skip the more complicated procedure, I grant that.
> >>>        Sincerely,
> >>>
> >>>                Gerard
> >>>
> >>>
> >>> p.s. On a somewhat related note, for the first test prototype is there 
> >>> any heat conduction from APV chip into the carrier board or something 
> >>> like that? In the same sort of way if it works without, fine, but if it 
> >>> does not we don't know if there is a real problem or only a trivial 
> >>> issue. The APV chip is somewhat temperature-sensitive I believe.
> >>>
> >>>
> >>> On 5/20/2019 8:04 PM, Yi Yang wrote:
> >>>> Hi Gerard,
> >>>> Yes, you are right. For the real one, it will be done in a vacuum bad 
> >>>> with pressure.
> >>>> The gluing procedure is well established in AIDC and we will provide 
> >>>> it soon.
> >>>> Cheers,
> >>>> Yi
> >>>> +++++++++++++++++++++++++++++++++++++++++++++++++++
> >>>> Yi Yang, Assistant Professor
> >>>> Department of Physics
> >>>> National Cheng Kung University
> >>>> Tainan, 701 Taiwan
> >>>> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
> >>>> Tel: +886-6-2757575 ext.65237
> >>>> Fax: +886-6-2747995
> >>>> Group Web: 
> >>>> https://urldefense.proofpoint.com/v2/url?u=http-3A__phys.ncku.edu.tw_-7Eyiyang&d=DwIDaQ&c=aTOVZmpUfPKZuaG9NO7J7Mh6imZbfhL47t9CpZ-pCOw&r=8ygAAI6gQzVe9hFCRdEAO5MwBJh2ID34fiwLpV3P1Xo&m=qJJlFMYZKdtBJJFLQZgiT0orfK52Q9WNFw5pB_aZvSk&s=Zy0OiGZEHrnLQn5ZL4xBSPWL8oo3DOprQsIZp511xKw&e=
> >>>>  +++++++++++++++++++++++++++++++++++++++++++++++++++
> >>>> On Mon, May 20, 2019 at 10:50 PM Gerard Visser <gvisser AT indiana.edu 
> >>>> <mailto:gvisser AT indiana.edu>> wrote:
> >>>>     hi Zhenyu, Li,
> >>>>              Just to check here: In order to wirebond the APV to 
> >>>> hybrid it's
> >>>>     certainly
> >>>>     necessary to have a solid support under the bod pads. So "glueing" 
> >>>> has to be
> >>>>     done in a vacuum bag or press or something, I think. Is the 
> >>>> procedure for this
> >>>>     gluing defined? I believe that the IST hybrid to stave was done in 
> >>>> a vacuum
> >>>>     bag,
> >>>>     although I really don't know. You might ask Eric Anderson.
> >>>>              Gerard
> >>>>     On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
> >>>>      > Hi Li,
> >>>>      >
> >>>>      > Please glue the hybrid to a bare PCB board, mount devices (R, C,
> >>>>     connectors) onto the hybrid, and then send it to me. Do you have a 
> >>>> rough
> >>>>     time estimate when this can be done?
> >>>>      >
> >>>>      > Thanks,
> >>>>      > Zhenyu
> >>>>      >
> >>>>      >> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn
> >>>>     <mailto:li.yi AT sdu.edu.cn>> wrote:
> >>>>      >>
> >>>>      >> Hi Zhenyu,
> >>>>      >>
> >>>>      >> As it was discussed, the whole system shall be tested 
> >>>> electronically
> >>>>     first. We will attach devices to hybrids and send it to you. Shall 
> >>>> hybrid be
> >>>>     glued on a *toy* supporting structure before sending to you so 
> >>>> that APVs
> >>>>     will be attached later? Or sending the hybrid with devices 
> >>>> attached but not
> >>>>     glued to supporters?
> >>>>      >>
> >>>>      >> Thanks,
> >>>>      >> Li
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