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  • From: Yi Yang <yiyang AT ncku.edu.tw>
  • To: Gerard Visser <gvisser AT indiana.edu>
  • Cc: star-fst-l AT lists.bnl.gov
  • Subject: Re: [Star-fst-l] (Questions to Zhenyu) Glue ordering for test
  • Date: Tue, 21 May 2019 08:04:49 +0800

Hi Gerard,

Yes, you are right. For the real one, it will be done in a vacuum bad with pressure. 
The gluing procedure is well established in AIDC and we will provide it soon. 

Cheers,
Yi


+++++++++++++++++++++++++++++++++++++++++++++++++++
Yi Yang, Assistant Professor
Department of Physics
National Cheng Kung University
Tainan, 701 Taiwan
E-Mail: yiyang AT ncku.edu.tw
Tel: +886-6-2757575 ext.65237
Fax: +886-6-2747995
Group Web: http://phys.ncku.edu.tw/~yiyang
+++++++++++++++++++++++++++++++++++++++++++++++++++


On Mon, May 20, 2019 at 10:50 PM Gerard Visser <gvisser AT indiana.edu> wrote:
hi Zhenyu, Li,
        Just to check here: In order to wirebond the APV to hybrid it's certainly
necessary to have a solid support under the bod pads. So "glueing" has to be
done in a vacuum bag or press or something, I think. Is the procedure for this
gluing defined? I believe that the IST hybrid to stave was done in a vacuum bag,
although I really don't know. You might ask Eric Anderson.

        Gerard


On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
> Hi Li,
>
> Please glue the hybrid to a bare PCB board, mount devices (R, C, connectors) onto the hybrid, and then send it to me. Do you have a rough time estimate when this can be done?
>
> Thanks,
> Zhenyu
>
>> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn> wrote:
>>
>> Hi Zhenyu,
>>
>> As it was discussed, the whole system shall be tested electronically first. We will attach devices to hybrids and send it to you. Shall hybrid be glued on a *toy* supporting structure before sending to you so that APVs will be attached later? Or sending the hybrid with devices attached but not glued to supporters?
>>
>> Thanks,
>> Li
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