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[Gerard Visser <gvisser AT indiana.edu>]

hi Yi,
	Thanks that sounds good. Is it impractical to do this for the first test too? I 
would think that, A. it is good to prototype that work in itself, and B. if this 
is skipped for the first test prototype the wirebonding might not work well, and 
if the hybrid seems not to work reliably we won't know if this might be the 
reason or if there might be a real problem. Of course if it does work well then 
it will have been fine to skip the more complicated procedure, I grant that.
        Sincerely,

                Gerard


p.s. On a somewhat related note, for the first test prototype is there any heat 
conduction from APV chip into the carrier board or something like that? In the 
same sort of way if it works without, fine, but if it does not we don't know if 
there is a real problem or only a trivial issue. The APV chip is somewhat 
temperature-sensitive I believe.


On 5/20/2019 8:04 PM, Yi Yang wrote:
> Hi Gerard,
>
> Yes, you are right. For the real one, it will be done in a vacuum bad with 
> pressure.
> The gluing procedure is well established in AIDC and we will provide it soon.
>
> Cheers,
> Yi
>
>
> +++++++++++++++++++++++++++++++++++++++++++++++++++
> Yi Yang, Assistant Professor
> Department of Physics
> National Cheng Kung University
> Tainan, 701 Taiwan
> E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
> Tel: +886-6-2757575 ext.65237
> Fax: +886-6-2747995
> Group Web: https://urldefense.proofpoint.com/v2/url?u=http-3A__phys.ncku.edu.tw_-7Eyiyang&d=DwIDaQ&c=aTOVZmpUfPKZuaG9NO7J7Mh6imZbfhL47t9CpZ-pCOw&r=8ygAAI6gQzVe9hFCRdEAO5MwBJh2ID34fiwLpV3P1Xo&m=qJJlFMYZKdtBJJFLQZgiT0orfK52Q9WNFw5pB_aZvSk&s=Zy0OiGZEHrnLQn5ZL4xBSPWL8oo3DOprQsIZp511xKw&e= 
> +++++++++++++++++++++++++++++++++++++++++++++++++++
>
>
> On Mon, May 20, 2019 at 10:50 PM Gerard Visser <gvisser AT indiana.edu 
> <mailto:gvisser AT indiana.edu>> wrote:
>
>     hi Zhenyu, Li,
>              Just to check here: In order to wirebond the APV to hybrid it's
>     certainly
>     necessary to have a solid support under the bod pads. So "glueing" has to 
> be
>     done in a vacuum bag or press or something, I think. Is the procedure for 
> this
>     gluing defined? I believe that the IST hybrid to stave was done in a 
> vacuum
>     bag,
>     although I really don't know. You might ask Eric Anderson.
>
>              Gerard
>
>
>     On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
>      > Hi Li,
>      >
>      > Please glue the hybrid to a bare PCB board, mount devices (R, C,
>     connectors) onto the hybrid, and then send it to me. Do you have a rough
>     time estimate when this can be done?
>      >
>      > Thanks,
>      > Zhenyu
>      >
>      >> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn
>     <mailto:li.yi AT sdu.edu.cn>> wrote:
>      >>
>      >> Hi Zhenyu,
>      >>
>      >> As it was discussed, the whole system shall be tested electronically
>     first. We will attach devices to hybrids and send it to you. Shall hybrid 
> be
>     glued on a *toy* supporting structure before sending to you so that APVs
>     will be attached later? Or sending the hybrid with devices attached but 
> not
>     glued to supporters?
>      >>
>      >> Thanks,
>      >> Li
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