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[Gerard Visser <gvisser AT indiana.edu>]

hi Li,
	I don't see much advantage to 2a) vs. 2b), if the mechanical details of these 
first hybrids differ from the real ones anyway. Plan 2b) sounds better if the 
main goal is test wire-bonding and to to exercise the hybrids and T-board etc. 
electrically and read out some APV data.

        Gerard

p.s. By the way, what is the finish on the wire-bond pads on the hybrid? Is it 
ENEPIG? (As far as I recall that is what was done on the IST hybrids.)


On 5/21/2019 2:08 AM, LI YI wrote:
> Thanks everyone for the comments!
>
> Zhenyu, so we will aim to deliver the one with all devices mounted and
> glued to a hard PCB.
>
> Two questions:
> 1. Is there minimal requirement/procedure for current gluing and what
> kind of glue shall be used?
> 2. Plan for hard PCB:
>      a. one PCB with inner and outer glued on two sides just like the
> design. We need to work with the company for the position for T-board
> connection. Inner and outer need to carefully align with each other so
> that we can connect them to T-board.
>      b. Two PCB with inner and outer glued on each board. It may give
> more flexibility for adjusting alignment ourself for the three parts
> (inner, outer, T-board).
>
> Here is a break-down for current time estimations:
>
> 1. at least 3 weeks for ordering R, C.
> We probably will use the connector pairs Yang Yi sent us. The mainland
> agent replied us that this type of connector is pretty new to them and
> is not in stock. They need to contact their main company in France
> which is still in holiday. So they don't have estimation for
> connectors. The connector pairs we had from Yi have been connected and
> disconnected many times by now and hopefully it still works.
>
> 2. ~3 weeks for mounting devices. We will contact company to mount the 
> devices.
>
> Best,
> Li
>
>
> On Tue, May 21, 2019 at 9:39 AM Zhenyu Ye <yezhenyu2003 AT gmail.com> wrote:
> > Hi Gerard, all,
> >
> > Let me summarize the status and plan of the module assembly and tests:
> >
> > There will be two versions of hybrids, and two versions of mechanical 
> > structures (hopefully) by the end of June.
> >
> > Version A: these are the ones we saw the BNL f2f meeting. Hybrids looked fine 
> > and passed the vendor’s tests. The first batch of MS looked bended at the 
> > corners. The second batch are expected on May 27. We don’t know how they will 
> > look like.
> >
> > Version B: still being worked on by NCKU and SDU. The design will be close to 
> > version A but with modified dimensions so that they match with each other and 
> > with the silicon sensors. These could take another 1.5 months.
> >
> > For the prototype modules, they will be made from version B of hybrids and 
> > MS, but they won’t be ready before the end of June, as explained above. In 
> > order to have a quick test of hybrids and test cables and training of the 
> > student with wire-bonder at UIC, we will start with version A of the hybrids 
> > attached on bare PCB, which is what Li and I discussed at the SDU workshop 
> > about 1.5 weeks ago and why Li sent the first email early today. I guess 
> > there is always a small possibility that things may not work well, but let’s 
> > see.
> >
> > Best,
> > Zhenyu
> >
> >
> > > On May 20, 2019, at 7:17 PM, Gerard Visser <gvisser AT indiana.edu> wrote:
> > >
> > > hi Yi,
> > >        Thanks that sounds good. Is it impractical to do this for the first 
> > > test too? I would think that, A. it is good to prototype that work in itself, 
> > > and B. if this is skipped for the first test prototype the wire bonding might 
> > > not work well, and if the hybrid seems not to work reliably we won't know if 
> > > this might be the reason or if there might be a real problem. Of course if it 
> > > does work well then it will have been fine to skip the more complicated 
> > > procedure, I grant that.
> > >        Sincerely,
> > >
> > >                Gerard
> > >
> > >
> > > p.s. On a somewhat related note, for the first test prototype is there any 
> > > heat conduction from APV chip into the carrier board or something like that? 
> > > In the same sort of way if it works without, fine, but if it does not we 
> > > don't know if there is a real problem or only a trivial issue. The APV chip 
> > > is somewhat temperature-sensitive I believe.
> > >
> > >
> > > On 5/20/2019 8:04 PM, Yi Yang wrote:
> > > > Hi Gerard,
> > > > Yes, you are right. For the real one, it will be done in a vacuum bad with 
> > > > pressure.
> > > > The gluing procedure is well established in AIDC and we will provide it soon.
> > > > Cheers,
> > > > Yi
> > > > +++++++++++++++++++++++++++++++++++++++++++++++++++
> > > > Yi Yang, Assistant Professor
> > > > Department of Physics
> > > > National Cheng Kung University
> > > > Tainan, 701 Taiwan
> > > > E-Mail: yiyang AT ncku.edu.tw <mailto:yiyang AT ncku.edu.tw>
> > > > Tel: +886-6-2757575 ext.65237
> > > > Fax: +886-6-2747995
> > > > Group Web: 
> > > > https://urldefense.proofpoint.com/v2/url?u=http-3A__phys.ncku.edu.tw_-7Eyiyang&d=DwIDaQ&c=aTOVZmpUfPKZuaG9NO7J7Mh6imZbfhL47t9CpZ-pCOw&r=8ygAAI6gQzVe9hFCRdEAO5MwBJh2ID34fiwLpV3P1Xo&m=qJJlFMYZKdtBJJFLQZgiT0orfK52Q9WNFw5pB_aZvSk&s=Zy0OiGZEHrnLQn5ZL4xBSPWL8oo3DOprQsIZp511xKw&e=
> > > >  +++++++++++++++++++++++++++++++++++++++++++++++++++
> > > > On Mon, May 20, 2019 at 10:50 PM Gerard Visser <gvisser AT indiana.edu 
> > > > <mailto:gvisser AT indiana.edu>> wrote:
> > > >     hi Zhenyu, Li,
> > > >              Just to check here: In order to wirebond the APV to hybrid it's
> > > >     certainly
> > > >     necessary to have a solid support under the bod pads. So "glueing" has to 
> > > > be
> > > >     done in a vacuum bag or press or something, I think. Is the procedure for 
> > > > this
> > > >     gluing defined? I believe that the IST hybrid to stave was done in a 
> > > > vacuum
> > > >     bag,
> > > >     although I really don't know. You might ask Eric Anderson.
> > > >              Gerard
> > > >     On 5/20/2019 10:45 AM, Zhenyu Ye wrote:
> > > >      > Hi Li,
> > > >      >
> > > >      > Please glue the hybrid to a bare PCB board, mount devices (R, C,
> > > >     connectors) onto the hybrid, and then send it to me. Do you have a rough
> > > >     time estimate when this can be done?
> > > >      >
> > > >      > Thanks,
> > > >      > Zhenyu
> > > >      >
> > > >      >> On May 20, 2019, at 9:42 AM, Li YI <li.yi AT sdu.edu.cn
> > > >     <mailto:li.yi AT sdu.edu.cn>> wrote:
> > > >      >>
> > > >      >> Hi Zhenyu,
> > > >      >>
> > > >      >> As it was discussed, the whole system shall be tested electronically
> > > >     first. We will attach devices to hybrids and send it to you. Shall hybrid 
> > > > be
> > > >     glued on a *toy* supporting structure before sending to you so that APVs
> > > >     will be attached later? Or sending the hybrid with devices attached but 
> > > > not
> > > >     glued to supporters?
> > > >      >>
> > > >      >> Thanks,
> > > >      >> Li
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